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SAF3560HV/V1103,55

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
SAF3560_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet Rev. 5 — 8 February 2013 16 of 24
NXP Semiconductors
SAF3560
Terrestrial digital radio processor
9. Package outline
Fig 5. Package outline SOT612-4 (HLQFP144)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT612-4
MS-026
SOT612-4
07-12-11
08-01-18
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
A
max
mm 1.6
0.12
0.05
1.45
1.35
0.27
0.17
0.20
0.09
20.1
19.9
4.3
4.1
4.3
4.1
0.5
22.15
21.85
1.4
1.1
1.4
1.1
A
1
DIMENSIONS (mm are the original dimensions)
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
0 5 10 mm
scale
A
2
A
3
0.25
b
p
c D
(1)
D
h
E
(1)
20.1
19.9
E
h
e H
D
22.15
21.85
H
E
L
1
L
p
0.75
0.45
v
0.2
y
0.08
w
0.08
Z
D
(1)
Z
E
(1)
θ
7
°
0
°
detail X
θ
A
L
A
2
(A
3
)
L
p
A
1
c
y
X
exposed die pad
b
p
b
p
D
E
H
D
H
E
Z
D
Z
E
B
A
e
e
w
M
w
M
vB
M
vA
M
D
h
E
h
144
136
37
72
73108
109
pin 1 index
SAF3560_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet Rev. 5 — 8 February 2013 17 of 24
NXP Semiconductors
SAF3560
Terrestrial digital radio processor
Fig 6. Package outline SOT1315-1 (LFBGA170)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1315-1
MO-205
sot1315-1_po
11-09-05
11-11-01
Unit
mm
max
nom
min
1.50
1.35
1.25
0.40 0.50 12.1 12.1
10.4 0.15 0.12
A
Dimensions (mm are the original dimensions)
LFBGA170: plastic low profile fine-pitch ball grid array package; 170 balls SOT1315-1
A
1
A
2
1.10
0.35 0.45 12.0 12.0 0.801.00
bDEee
1
10.4
0.30 0.40 11.9 11.90.95
e
2
vw
0.08
yy
1
0.10
0
10 mm
scale
detail X
e
X
AC
B
Ø v
CØ w
ball A1
index area
ball A1
index area
B
D
A
E
A
A
2
A
1
P
N
1234567891011121314
C
y
C
y
1
e
1
e
2
1/2 e
e
M
L
K
J
H
G
F
E
D
C
B
A
1/2 e
SAF3560_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product short data sheet Rev. 5 — 8 February 2013 18 of 24
NXP Semiconductors
SAF3560
Terrestrial digital radio processor
10. Soldering
Fig 7. Soldering footprint SOT612-4 (HLQFP144)
SOT612-4
DIMENSIONS in mm
Footprint information for reflow soldering of HLQFP144 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
occupied area
solder paste
solder land
SPx tot
SPy tot
nSPx
nSPy
SPx
SPy
SLx
SLy
nSPx nSPy
44
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
23.300 23.300 20.300 20.300
P1
0.500
P2
0.560 0.280
C
1.500 0.400 20.500 20.500 23.550 23.550
SLx SLy SPx tot SPy tot SPx SPy
4.500 4.500 4.400 4.400 0.750 0.750
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SAF3560HV/V1103,55

Mfr. #:
Buy SAF3560HV/V1103,55
Manufacturer:
NXP Semiconductors
Description:
DIGITAL RADIO PROCESSOR 144HLQFP
Lifecycle:
New from this manufacturer.
Delivery:
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