Characteristics STPS3150
4/9 Doc ID 9474 Rev 6
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values)
Figure 8. Junction capacitance versus reverse
voltage applied (typical values)
I
R
(µA)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125 150
V (V)
R
T
j
= 125 °C
T
j
= 150 °C
T
j
= 100 °C
T
j
= 50 °C
T
j
= 25 °C
T
j
= 75 °C
C(pF)
10
100
1000
1 10 100 1000
F = 1 MHZ
V = 30 mV
OSC RMS
T
j
= 25 °C
V (V)
R
Figure 9. Forward voltage drop versus forward
current
Figure 10. Thermal resistance junction to
ambient versus copper surface under each lead
(typical values)
I (A)
F
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
V (V)
F
T
j
= 25 °C
(maximum values)
T
j
= 125 °C
(typical values)
T
j
= 125 °C
(maximum values)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMB
epoxy printed board copper thickness = 35 µmFR4
S
Cu
(cm²)
Figure 11. Thermal resistance junction to
ambient versus copper surface under each lead
(typical values)
Figure 12. Thermal resistance versus lead
length
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMBflat
S
Cu
(cm²)
epoxy printed board copper thickness = 35 µmFR4
0
10
20
30
40
50
60
70
80
90
510152025
R
t
h
(°C/
W
)
R
th(j
-
a)
R
th(j
-
l)
DO-201AD
L
leads
(mm)
