© 1999 Fairchild Semiconductor Corporation DS005214 www.fairchildsemi.com
February 1984
Revised October 1999
MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter
MM74HC4049 • MM74HC4050
Hex Inverting Logic Level Down Converter •
Hex Logic Level Down Converter
General Description
The MM74HC4049 and the MM74HC4050 utilize
advanced silicon-gate CMOS technology, and have a mod-
ified input protection structure that enables these parts to
be used as logic level translators which will convert high
level logic to a low level logic while operating from the low
logic supply. For example, 0–15V CMOS logic can be con-
verted to 0–5V logic when using a 5V supply. The modified
input protection has no diode connected to V
CC
, thus allow-
ing the input voltage to exceed the supply. The lower zener
diode protects the input from both positive and negative
static voltages. In addition each part can be used as a sim-
ple buffer or inverter without level translation. The
MM74HC4049 is pin and functionally compatible to the
CD4049BC and the MM74HC4050 is compatible to the
CD4050BC
Features
■ Typical propagation delay: 8 ns
■ Wide power supply range: 2V–6V
■ Low quiescent supply current: 20 µA maximum (74HC)
■ Fanout of 10 LS-TTL loads
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
MM74HC4049
MM74HC4050
Order Number Package Number Package Description
MM74HC4049M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC4049SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC4049MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
MM74HC4049N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
MM74HC4050M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC4050SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC4050MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
MM74HC4050N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide