LTC1646
16
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Figure 11. 5V Supply Only Typical Application
Figure 12. BD_SEL# Pushbutton Toggle Switch
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If no 3.3V supply is present, Figure 11 illustrates how the
LTC1646 should be configured. First, 3V
SENSE
(Pin 9) is
connected to 3V
IN
(Pin 8), 3V
OUT
(Pin 7) is connected to
5V
OUT
(Pin 5) and the LTC1646’s 3V
IN
pin is connected
through a diode (BAV16W) to 5V
IN
.
For applications where the BD_SEL# connector pin is
typically grounded on the backplane, the circuit in
Figure 12 allows the LTC1646 to be reset simply by
pressing a pushbutton switch on the CPCI plug-in board.
This arrangement eliminates the requirement to extract
and reinsert the CPCI board in order to reset the LTC1646’s
circuit breakers.
Overvoltage Transient Protection
Good engineering practice calls for bypassing the supply
rail of any analog circuit. Bypass capacitors are often
placed at the supply connection of every active device, in
addition to one or more large-value bulk bypass capacitors
per supply rail. If power is connected abruptly, the large
bypass capacitors slow the rate of rise of the supply
voltage and heavily damp any parasitic resonance of lead
or PC trace inductance working against the supply bypass
capacitors.
The opposite is true for LTC1646 Hot Swap circuits
mounted on plug-in cards. In most cases, there is no
supply bypass capacitor present on the powered 3.3V or
5V side of the MOSFET switch. An abrupt connection,
produced by inserting the board into a backplane connec-
tor, results in a fast rising edge applied on the 3.3V and the
5V line of the LTC1646.
2.7
10
0.007
1k
3V
IN
3V
SENSE
5V
SENSE
GATE 5V
OUT
3V
OUT
5V
IN
5V
IN
0.1µF
0.01µF
IRF7413
5V
OUT
LTC1646
8 9 12 11 10 5 7
6
BAV16W
1646 F11
GND
COMPACT PCI
BACKPLANE
CONNECTOR
(MALE)
COMPACT PCI
CIRCUIT CARD
CONNECTOR
(FEMALE)
GND
5V
LONG
5V
4
3
21
Z1: BZX84C6V2
Z1
BD_SEL#
1k
100
LONG GND
15
6
OFF/ON
LTC1646
GND
V(I/0)
PUSH-
BUTTON
SWITCH
1646 F12
1.2k
COMPACT PCI
BACKPLANE
CONNECTOR
(MALE)
COMPACT PCI
CIRCUIT CARD
CONNECTOR
(FEMALE)
LTC1646
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Figure 14. Recommended Layout for
Transient Protection Components
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VIAS TO
GND PLANE
3V
IN
GND
LTC1646*
*ADDITIONAL DETAILS OMITTED FOR CLARITY
DRAWING IS NOT TO SCALE!
1646 F14
5V
IN
TZ1
TZ2
C2
C3
Since there is no bulk capacitance to damp the parasitic
trace inductance, supply voltage transients excite para-
sitic resonant circuits formed by the power MOSFET
capacitance and the combined parasitic inductance from
the wiring harness, the backplane and the circuit board
traces. These ringing transients appear as a fast edge on
the 3.3V or 5V supply, exhibiting a peak overshoot to 2.5
times the steady-state value followed by a damped sinu-
soidal response whose duration and period is dependent
on the resonant circuit parameters. Since the absolute
maximum supply voltage of the LTC1646 is 10V, transient
protection against 3.3V and 5V supply voltage spikes and
ringing is highly recommended.
In these applications, there are two methods for eliminat-
ing these supply voltage transients: using Zener diodes to
clip the transient to a safe level and snubber networks.
Snubbers are RC networks whose time constants are
large enough to safely damp the inductance of the board’s
parasitic resonant circuits. As a starting point, the shunt
capacitors in these networks are chosen to be 10× to 100×
the power MOSFET’s C
OSS
under bias. The value of the
series resistor (R6 and R7 in Figure 13) is then chosen to
be large enough to damp the resulting series R-L-C circuit
and typically ranges from 1 to 10. Note that in all
Figure 13. Place Transient Protection Device Close to the LTC1646
C1
0.01µF
C2
0.1µF
C3
0.1µF
3V
IN
V
IN2
3.3V
V
IN1
5V
3V
SENSE
8
3V
OUT
7
5V
IN
12
5V
OUT
5
5V
SENSE
119
GATE
10
R3
10
R4
10
5V
OUT
AT 5A
3V
OUT
AT 7.6A
R5
1k
R1
0.005
Q2
IRF7413
Q1
IRF7413
R2
0.007
Z1
Z2
LTC1646**
1646 F13
GND
6
Z1, Z2: BZX84C6V2
**ADDITIONAL DETAILS OMITTED FOR CLARITY
R6 2.7
LONG 5V
R7 1.8
LONG 3.3V
LTC1646 circuit schematics, Zener diodes and snubber
networks have been added to each 3.3V and 5V supply rail
and should be used always. These protection networks
should be mounted very close to the LTC1646’s supply
voltage using short lead lengths to minimize lead induc-
tance. This is shown schematically in Figure 13 and a
recommended layout of the transient protection devices
around the LTC1646 is shown in Figure 14.
LTC1646
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Table 6. N-Channel Power MOSFET Selection Guide
CURRENT LEVEL (A) PART NUMBER DESCRIPTION MANUFACTURER
0 to 2 MMDF3N02HD Dual N-Channel SO-8 ON Semiconductor
R
DS(ON)
= 0.1
2 to 5 MMSF5N02HD Single N-Channel SO-8 ON Semiconductor
R
DS(ON)
= 0.025
5 to 10 MTB50N06V Single N-Channel DD Pak ON Semiconductor
R
DS(ON)
= 0.028
5 to 10 IRF7413 Single N-Channel SO-8 International Rectifier
R
DS(ON)
= 0.01
5 to 10 Si4410DY Single N-Channel SO-8 Vishay-Siliconix
R
DS(ON)
= 0.01
Table 7. Sense Resistor Selection Guide
CURRENT LIMIT VALUE PART NUMBER DESCRIPTION MANUFACTURER
1A LR120601R055F 0.055, 0.5W, 1% Resistor IRC-TT
WSL1206R055 Vishay-Dale
2A LR120601R028F 0.028, 0.5W, 1% Resistor IRC-TT
WSL1206R028 Vishay-Dale
5A LR120601R011F 0.011, 0.5W, 1% Resistor IRC-TT
WSL2010R011 Vishay-Dale
7.6A WSL2512R007 0.007, 1W, 1% Resistor Vishay-Dale
10A WSL2512R005 0.005, 1W, 1% Resistor Vishay-Dale
PCB Layout Considerations
For proper operation of the LTC1646’s circuit breaker
function, a 4-wire Kelvin connection to the sense resistors
is highly recommended. A recommended PCB layout for
the sense resistor, the power MOSFET, and the GATE drive
components around the LTC1646 is illustrated in
Figure 15. In Hot Swap applications where load currents
can reach 10A, narrow PCB tracks exhibit more resistance
than wider tracks and operate at more elevated tempera-
tures. Since the sheet resistance of 1 ounce copper foil is
approximately 0.5m/
, track resistances add up quickly
in high current applications. Thus, to keep PCB track
resistance and temperature rise to a minimum, the sug-
gested trace width in these applications for 1 ounce
copper foil is 0.03" for each ampere of DC current.
In the majority of applications, it will be necessary to use
plated-through vias to make circuit connections from
component layers to power and ground layers internal to
the PC board. For 1 ounce copper foil plating, a general rule
is 1A of DC current per via, making sure the via is properly
dimensioned so that solder completely fills any void. For
other plating thicknesses, check with your PCB fabrication
facility.
Power MOSFET and Sense Resistor Selection
Table 6 lists some current MOSFET transistors that are
available and Table 7 lists some current sense resistors
that can be used with the LTC1646’s circuit breakers.
Table 8 lists supplier web site addresses for discrete
component mentioned throughout the LTC1646 data sheet.
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LTC1646IGN#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers CompactPCI 2x Hot Swap Cntr
Lifecycle:
New from this manufacturer.
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