REV. B
AD8041
–5–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage ............................................................ 12.6 V
Internal Power Dissipation
2
PDIP Package (N) .................................................... 1.3 W
SOIC Package (R) .................................................... 0.9 W
Input Voltage (Common Mode) ...................................... ± V
S
Differential Input Voltage ........................................... ± 3.4 V
Output Short-Circuit Duration
.......................................... Observe Power Derating Curves
Storage Temperature Range N, R .............. –65°C to +125°C
Operating Temperature Range (A Grade) ... –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) ............... 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for the device in free air:
8-Lead PDIP Package: θ
JA
= 90°C/W.
8-Lead SOIC Package: θ
JA
= 155°C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8041 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Exceeding this limit temporarily
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure.
While the AD8041 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (
ⴗ
C)
2.0
1.5
0
–50 90–40 –30 –20 –10 0 10 20 30 50 60 70 8040
1.0
0.5
8-LEAD PDIP PACKAGE
8-LEAD SOIC PACKAGE
T
J
= 150
ⴗ
C
Figure 3. Maximum Power Dissipation vs. Temperature
ORDERING GUIDE
Temperature Package Package
Model Range Description Options
AD8041AN –40°C to +85°C 8-Lead PDIP N-8
AD8041AR –40°C to +85°C 8-Lead Plastic SOIC R-8
AD8041AR-REEL –40°C to +85°C 13" Tape and Reel R-8
AD8041AR-REEL7 –40°C to +85°C 7" Tape and Reel R-8
AD8041ARZ-REEL
1
–40°C to +85°C 13" Tape and Reel R-8
5962-9683901MPA
2
–55°C to +125°C 8-Lead CERDIP Q-8
NOTES
1
The Z indicates a lead-free product.
2
Refer to official DSCC drawing for tested specifications.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8041 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
