NB4N855SMEVB
http://onsemi.com
6
PACKAGE DIMENSIONS
Micro−10
CASE 846B−03
ISSUE D
S
B
M
0.08 (0.003) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C 0.95 1.10 0.037 0.043
D 0.20 0.30 0.008 0.012
G 0.50 BSC 0.020 BSC
H 0.05 0.15 0.002 0.006
J 0.10 0.21 0.004 0.008
K 4.75 5.05 0.187 0.199
L 0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B−01 OBSOLETE. NEW STANDARD
846B−02
−B−
−A−
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
C
H
J
L
ǒ
mm
inches
Ǔ
SCALE 8:1
10X 10X
8X
1.04
0.041
0.32
0.0126
5.28
0.208
4.24
0.167
3.20
0.126
0.50
0.0196
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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