FDU8796

March 2006
FDD8796/FDU8796 N-Channel PowerTrench
®
MOSFET
©2006 Fairchild Semiconductor Corporation
FDD8796/FDU8796 Rev. B
www.fairchildsemi.com1
FDD8796/FDU8796
N-Channel PowerTrench
®
MOSFET
25V, 35A, 5.7m
General Description
This N-Channel MOSFET has been designed specifically to
improve the overall efficiency of DC/DC converters using
either synchronous or conventional switching PWM
controllers. It has been optimized for low gate charge, low
r
DS(on)
and fast switching speed.
Application
Vcore DC-DC for Desktop Computers and Servers
VRM for Intermediate Bus Architecture
Features
Max r
DS(on)
= 5.7m at V
GS
= 10V, I
D
= 35A
Max r
DS(on)
= 8.0m at V
GS
= 4.5V, I
D
= 35A
Low gate charge: Q
g(10)
= 37nC(Typ), V
GS
= 10V
Low gate resistance
Avalanche rated and 100% tested
RoHS Compliant
D
G
S
Short Lead I-PAK
I-PAK
(TO-251AA)
G
DS
G
D
S
MOSFET Maximum Ratings T
C
= 25°C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 25 V
V
GS
Gate to Source Voltage ±20 V
I
D
Drain Current -Continuous (Package Limited) 35
A -Continuous (Die Limited) 98
-Pulsed (Note 1) 305
E
AS
Single Pulse Avalanche Energy (Note 2) 91 mJ
P
D
Power Dissipation 88 W
T
J
, T
STG
Operating and Storage Temperature -55 to 175 °C
R
θJC
Thermal Resistance, Junction to Case TO_252, TO_251 1.7 °C/W
R
θJA
Thermal Resistance, Junction to Ambient TO_252, TO_251 100 °C/W
R
θJA
Thermal Resistance, Junction to Ambient TO-252,1in
2
copper pad area 52 °C/W
Device Marking Device Package Reel Size Tape Width Quantity
FDD8796 FDD8796 TO-252AA 13’’ 12mm 2500 units
FDU8796 FDU8796 TO-251AA N/A (Tube) N/A 75 units
FDU8796 FDU8796_F071 TO-251AA N/A (Tube) N/A 75 units
L
E
A
D
F
R
E
E
M
T
A
E
L
N
T
I
O
M
P
E
N
I
FDD8796/FDU8796 N-Channel PowerTrench
®
MOSFET
FDD8796/FDU8796 Rev. B
2 www.fairchildsemi.com
Electrical Characteristics T
J
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B
VDSS
Drain to Source Breakdown Voltage I
D
= 250µA, V
GS
= 0V 25 V
B
VDSS
T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250µA, referenced to
25
°C
7 mV/°C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 20V
V
GS
= 0V T
J
= 150°C
1
µA
250
I
GSS
Gate to Source Leakage Current V
GS
= ±20V ±100 nA
On Characteristics
V
GS(th)
Gate to Source Threshold Voltage V
GS
= V
DS
, I
D
= 250µA 1.2 1.8 2.5 V
V
GS(th)
T
J
Gate to Source Threshold Voltage
Temperature Coefficient
I
D
= 250µA, referenced to
25
°C
-6.7 mV/°C
r
DS(on)
Drain to Source On Resistance
V
GS
= 10V, I
D
= 35A 4.5 5.7
m
V
GS
= 4.5V, I
D
= 35A 6.0 8.0
V
DS
= 10V, I
D
= 35A
T
J
= 175°C
6.9
9.5
Dynamic Characteristics
C
iss
Input Capacitance
V
DS
= 13V, V
GS
= 0V,
f = 1MHz
1960 2610 pF
C
oss
Output Capacitance 455 605 pF
C
rss
Reverse Transfer Capacitance 315 475 pF
R
G
Gate Resistance f = 1MHz 1.1
Switching Characteristics
t
d(on)
Turn-On Delay Time
V
DD
=13V, I
D
= 35A
V
GS
= 10V, R
GS
= 20
10 20 ns
t
r
Rise Time 24 39 ns
t
d(off)
Turn-Off Delay Time 99 158 ns
t
f
Fall Time 57 91 ns
Q
g
Total Gate Charge V
GS
= 0 to10V
V
DD
=13V,
I
D
= 35A,
I
g
= 1.0mA
37 52 nC
Q
g
Total Gate Charge V
GS
= 0 to 5V 19 27 nC
Q
gs
Gate to Source Gate Charge 6 nC
Q
gd
Gate to Drain Charge 6 nC
Drain-Source Diode Characteristics
V
SD
Source to Drain Diode Voltage
V
GS
= 0V, I
S
= 35A 0.9 1.25 V
V
GS
= 0V, I
S
= 15A 0.8 1.0 V
t
rr
Reverse Recovery Time I
F
= 35A, di/dt = 100A/µs 30 45 ns
Q
rr
Reverse Recovery Charge I
F
= 35A, di/dt = 100A/µs 23 35 nC
Notes:
1: Pulse time < 300µs, Duty cycle = 2%.
2: Starting T
J
= 25°C, L = 0.3mH, I
AS
= 24.7A, V
DD
= 23V, V
GS
= 10V.
FDD8796/FDU8796 N-Channel PowerTrench
®
MOSFET
FDD8796/FDU8796 Rev. B
3 www.fairchildsemi.com
Typical Characteristics T
J
= 25°C unless otherwise noted
Figure 1. On Region Characteristics
01234
0
10
20
30
40
50
60
70
V
GS
= 3.5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
V
GS
= 3V
V
GS
= 4.5V
V
GS
= 10V
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
Figure 2. Normalized
0 10203040506070
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
V
GS
= 3V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
I
D
, DRAIN CURRENT(A)
V
GS
= 10V
V
GS
= 4.5V
V
GS
= 3.5V
On-Resistance vs Drain
Current and Gate Voltage
Figure 3.
-80 -40 0 40 80 120 160 200
0.6
0.8
1.0
1.2
1.4
1.6
1.8
T
J
, JUNCTION TEMPERATURE (
o
C)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
I
D
= 35A
V
GS
= 10V
Normalized On Resistance vs Junction
Temperature
Figure 4.
246810
2
4
6
8
10
12
14
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
T
J
= 175
o
C
T
J
= 25
o
C
I
D
=35A
r
DS(on)
, ON-RESISTANCE (m)
V
GS
, GATE TO SOURCE VOLTAGE (V)
On-Resistance vs Gate to Source
Voltage
Figure 5. Transfer Characteristics
01234
0
10
20
30
40
50
60
70
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
T
J
= -55
o
C
T
J
= 25
o
C
T
J
= 175
o
C
I
D
, DRAIN CURRENT (A)
V
GS
, GATE TO SOURCE VOLTAGE (V)
Figure 6.
0.0 0.3 0.6 0.9 1.2
1E-3
0.01
0.1
1
10
100
T
J
= -55
o
C
T
J
= 25
o
C
T
J
= 175
o
C
V
GS
= 0V
I
S
, REVERSE DRAIN CURRENT (A)
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
Source to Drain Diode Forward
Voltage vs Source Current

FDU8796

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 25V 35A I-PAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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