V
DD
to GND .........................................................-0.3V to +6.0V
RS+, RS- to GND ..................................................-0.3V to +80V
RS+ to RS- (Continuous) ....................................................±24V
Continuous (> 1s) Input Current (Any Pin) .......................±10mA
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Reflow Soldering Peak Temperature (Pb-free) ...............+260°C
6-Bump WLP
Continuous Power Dissipation
(Derate mW/°C above +70°C) ................................. 12.34mW
Junction-to-Ambient Thermal Resistance (θ
JA
) .....81.03°C/W
6-Pin SOT23
Continuous Power Dissipation
(Derate mW/°C above +70°C) ................................. 13.40mW
Junction-to-Ambient Thermal Resistance (θ
JA
) .....74.60°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ..............6.0°C/W
(Note 1)
(V
RS+
= V
RS-
= +36V, V
DD
= +3.3V, V
SENSE
= V
RS+
-V
RS-
= 1mV, T
A
= -40°C to +125°C unless otherwise noted. Typical values are
at T
A
=+25°C). (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Supply Voltage V
DD
Guaranteed by PSRR 2.7 5.5 V
Supply Current I
DD
T
A
= +25°C 350
µA
-40°C < T
A
<
+125°C 800
Power-Supply Rejection Ratio PSRR 2.7V ≤ V
DD
≤ 5.5V 110 120 dB
Input Common-Mode Voltage
Range
V
CM
Guaranteed by CMRR 2.7 76 V
Input Bias Current at V
RS+
and V
RS-
I
RS+
, I
RS-
65 µA
Input Oset Current I
RS+
-
I
RS-
400 nA
Input Leakage Current I
RS+
, I
RS-
V
DD
= 0V, V
RS+
= 76V 5 µA
Common-Mode Rejection Ratio CMRR +4.5V < V
RS+
< +76V 125 140 dB
Input Oset Voltage V
OS
T
A
= +25°C ±12
µV
-40°C ≤ T
A
≤ +85°C ±25
-40°C ≤ T
A
≤ +125°C ±25
Input Oset Voltage Drift TCV
OS
130 nV/°C
Input Sense Voltage V
SENSE
MAX40010L (G = 12.5V/V) 200
mV
MAX40010T (G = 20V/V) 125
MAX40010F (G = 50V/V) 50
MAX40010H (G=100V/V) 25
MAX40010 76V Precision, High-Voltage,
Current-Sense Amplier
www.maximintegrated.com
Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics
