GS1A-L
THRU
GS1M-L
1.0 Amp Glass
Passivated Rectifier
50 to 1000 Volts
DO-214AC
(SMA) (LEAD FRAME)
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Reccurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
GS1A-L GS1A50V35V50V
GS1B-L GS1B100V70V100V
GS1D-L GS1D200V140V200V
GS1G-L GS1G400V280V400V
GS1J-L GS1J600V420V600V
GS1K-L GS1K800V560V800V
GS1M-L GS1M1000V700V1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I
F(AV)
1.0A
T
L
= 110°C
Peak Forward Surge
Current
I
FSM
30A 8.3ms, half sine,
Maximum
Instantaneous
Forward Voltage
V
F
1.0V
I
FM
= 1.0A;
T
J
= 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I
R
10µA
50µA
T
J
= 25°C
T
J
= 125°C
Typical Junction
Capacitance
C
J
15pF Measured at
1.0MHz, V
R
=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
H
J
E
G
D
0.070”
0.090”
0.085”
SUGGESTED SOLDER
PAD LAYOUT
omponents
20736 Marilla Street Chatsworth
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MCC
• Extremely Low Thermal Resistance
• High Temp Soldering: 260°C for 10 Seconds At Terminals
Revision: D 2013/01/01
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .079 .096 2.00 2.44
B .050 .064 1.27 1.63
C --- .008--- .20
D --- .02 --- .51
E .030 .060 .76 1.52
F.065.0911.652.32
G .189 .220 4.80 5.59
H .157 .181 4.00 4.60
J .090 .115 2.25 2.92
TM
Micro Commercial Components
DIMENSIONS
x Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Note 1: High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
1 of 4
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Features
• Halogen free available upon request by adding suffix "-HF"
