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TDA8594J/N1S

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P49
TDA8594 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 43 of 49
NXP Semiconductors
TDA8594
I
2
C-bus controlled 4 50 W power amplifier
15. Package outline
Fig 37. Package outline SOT827-1 (DBS27P)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT827-1
sot827-1_po
13-02-13
13-05-30
Unit
mm
max
nom
min
19
4.6
4.4
0.5
0.3
29.2
28.8
24.8
24.4
15.9
15.5
3.55
3.25
12
21 8
1.15
0.85
22.9
22.1
2.1
1.8
A
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) SOT827-1
A
2
b
p
0.60
0.45
cD
(1)
dD
h
0.6
0.25
Qvw
0.03
1.8
1.2
xZ
(1)
E
(1)
ee
1
e
2
4
E
h
jL
3.40 6.8
L
2
3.9
3.1
L
3
L
4
4
m
0 10 20 mm
scale
x
e
2
e
1
e
m
B
w
v
L
E
A
A
2
L
3
L
4
L
2
D
h
E
h
non-concave
view B: mounting base side
D
b
p
d
Z
1 27
j
c
Q
TDA8594 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 44 of 49
NXP Semiconductors
TDA8594
I
2
C-bus controlled 4 50 W power amplifier
Fig 38. Package outline SOT878-1 (RDBS27P)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT878-1
sot878-1_po
12-12-19
13-02-13
Unit
mm
max
nom
min
13.5
4.6
4.4
0.5
0.3
29.2
28.8
24.8
24.4
15.9
15.5
12
2 1 8 3.40
2.1
1.8
1.8
1.2
0.6
A
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm) SOT878-1
A
2
b
p
0.60
0.45
cD
(1)
dD
h
0.03
xZ
(1)
E
(1)
ee
1
e
2
2.54
E
h
jL
3.55
3.25
L
1
3.75
3.15
3.75
3.15
Qv
0.25
w
b
p
D
d
D
h
A
2
L
c
L
1
QZ
E
h
E
j
x
e
2
A
e
1
e
v
w
view B: mounting base side
non-concave
B
271
0 10 20 mm
scale
TDA8594 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 11 June 2013 45 of 49
NXP Semiconductors
TDA8594
I
2
C-bus controlled 4 50 W power amplifier
16. Mounting
17. Abbreviations
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e
1
’ in Figure 38; dimension ‘2’ relates to dimension ‘e
2
’ in
Figure 38
.
Fig 39. SOT878-1 reflow soldering footprint
sot878-1_fr
Dimensions in mm
∅ 0.08
M
27
26
1
2
hole diameter min. 0.92
2.54
1
2
Table 18. Abbreviations
Acronym Description
ACK
ACKnowledge not
BCDMOS Bipolar CMOS/DMOS
BTL Bridge Tied Load
CMOS Complementary Metal-Oxide Semiconductor
DMOS Double-diffused Metal-Oxide Semiconductor
DSP Digital Signal Processor
EMC ElectroMagnetic Compatibility
ESR Equivalent Series Resistance
LSB Least Significant Bit
MSB Most Significant Bit
NMOS Negative-channel Metal-Oxide Semiconductor
PMOS Positive-channel Metal-Oxide Semiconductor
PCB Printed-Circuit Board
POR Power-On Reset
SOAR Safe Operating ARea
SOI Silicon On Insulator
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P49

TDA8594J/N1S

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Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers PWR AMP 4x50W
Lifecycle:
New from this manufacturer.
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