NLV74HC245ADWR2G

MC74HC245A
http://onsemi.com
4
ORDERING INFORMATION
Device Package Shipping
MC74HC245ADWG SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
NLV74HC245ADWG* SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
MC74HC245ADWR2G SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
NLV74HC245ADWR2G* SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
MC74HC245ADTG TSSOP−20
(Pb−Free)
75 Units / Rail
NLV74HC245ADTG* TSSOP−20
(Pb−Free)
75 Units / Rail
MC74HC245ADTR2G TSSOP−20
(Pb−Free)
2500 Tape & Reel
NLV74HC245ADTR2G* TSSOP−20
(Pb−Free)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
V
CC
GND
t
f
t
r
INPUT
A OR B
OUTPUT
B OR A
10%
50%
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
Figure 1. Switching Waveform
OUTPUT
ENABLE
A OR B
A OR B
50%
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
V
CC
GND
50%
Figure 2. Switching Waveform
DIRECTION
OUTPUT
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
Figure 3. Test Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kW
MC74HC245A
http://onsemi.com
5
Figure 5. Expanded Logic Diagram
A
DATA
PORT
B
DATA
PORT
OUTPUT ENABLE
DIRECTION
A1
A2
A3
A4
A5
A6
A7
A8
2
3
4
5
6
7
8
9
19
1
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
13
12
11
MC74HC245A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

NLV74HC245ADWR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Logic Gates OCTAL 3-STATE NON-IN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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