date 05/04/2017
page
1 of 4
cui.com
SERIES: HSE-BX-040H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B20254-040H 25.4 13.16 16.13 7.74 5.77 5.70
HSE-B20381-040H 38.1 11.54 12.28 3.62 2.88 6.50
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
Dissipated Power (W)
67 89
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 16.13 7.74 5.77
2 29.25 15.62 11.53
3 42.80 23.81 17.04
4 55.72 31.68 22.66
5 67.84 39.53 28.21
6 78.06 47.35 33.83
7 88.34 54.42 39.65
8 97.77 62.21 45.28
9 107.55 69.81 50.42
10 117.33 77.16 56.11
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B20254-040H
For more information, please visit the product page.
