MC10H330FN

MC10H330
http://onsemi.com
4
PACKAGE DIMENSIONS
PLCC28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 77602
ISSUE D
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
M
L
V
W
D
D
Y BRK
28 1
VIEW S
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
0.004 (0.100)
G1
G
J
C
Z
R
E
A
SEATING
PLANE
S
L−M
M
0.007 (0.180) N
S
T
T
B
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
U
S
L−M
M
0.007 (0.180) N
S
T
Z
G1X
VIEW DD
S
L−M
M
0.007 (0.180) N
S
T
K1
VIEW S
H
K
F
S
L−M
M
0.007 (0.180) N
S
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 −−− 1.02 −−−
__ __
MC10H330
http://onsemi.com
5
PACKAGE DIMENSIONS
CDIP24
L SUFFIX
CERAMIC DIP PACKAGE
CASE 75802
ISSUE A
C
N
K
F
G
B
1
24
12
13
L P
J
SEATING
PLANE
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.240 1.285 31.50 32.64
INCHES
B 0.285 0.305 7.24 7.75
C 0.160 0.200 4.07 5.08
D 0.015 0.021 0.38 0.53
F 0.045 0.062 1.14 1.57
G 0.100 BSC 2.54 BSC
J 0.008 0.013 0.20 0.33
K 0.100 0.165 2.54 4.19
L 0.300 0.310 7.62 7.87
N 0.020 0.050 0.51 1.27
P 0.360 0.400 9.14 10.16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
0.25 (0.010)
M
TA
M
D 24 PL
T
A
PDIP24
P SUFFIX
PLASTIC DIP PACKAGE
CASE 72403
ISSUE D
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
A
B
24 13
12
1
T
SEATING
PLANE
24 PL
K
E
F
N
C
D
G
M
A
M
0.25 (0.010) T
24 PLJ
M
B
M
0.25 (0.010) T
L
M
NOTE 1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.230 1.265 31.25 32.13
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.020 0.38 0.51
E 0.050 BSC 1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC 2.54 BSC
J 0.007 0.012 0.18 0.30
K 0.110 0.140 2.80 3.55
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
____
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MECL 10H and MECL 10K are trademarks of Motorola, Inc.
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MC10H330FN

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers Triple Diff
Lifecycle:
New from this manufacturer.
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