MAX14629
Maxim Integrated Products. All rights reserved. Page 4/5
= ___1___ =
______1.83_______ (Chi square value for MTTF upper limit)
MTTF
192 x 4340 x 79 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
V. Quality Assurance Information
A. Quality Assurance Contacts: Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= 13.9 x 10
-9
= 13.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S18 Process results in a FIT Rate of 0.40 @ 25C and 6.96 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot EAEF6A020A D/C 1204)
The AL31-1 die type has been found to have all pins able to withstand a HBM transient pulse of:
ESD-HBM: +/-2500V per JEDEC JESD22-A114
ESD-MM: +/-160V per JEDEC JESD22-A115
Latch-Up testing has shown that this device withstands a current of +/-250mA and overvoltage per JEDEC JESD78.
