Pin settings SPZB32W1x2.1
10/19 Doc ID 018899 Rev 2
21
PC0 I/O 40 Digital I/O (high current)
JRST I 40 JTAG reset input from debugger
TRACEDATA1 O 40 Synchronous CPU trace data bit 1
IRQD I 40 External interrupt source D
22
PB7 I/O 41 Digital I/O
TIM1_CH2 O 41 Timer 1 channel 2 output
TIM1 _CH2 I 41 Timer 1 channel 2 input
IRQC I 41 External interrupt source C
ADC2 I 41 ADC input 2
23
PB6 I/O 42 Digital I/O
TIM1_CH1 O 42 Timer 1 channel 1 output
TIM1_CH1 I 42 Timer 1 channel 1 input
IRQB I 42 External interrupt source B
ADC1 Analog 42 ADC input 1
24
PA6 I/O 29 Digital I/O
TIM1_CH3 O 29 Timer 1 channel 3 output
TIM1_CH3 I 29 Timer 1 channel 3 input
25
PA7 I/O 18 Digital I/O
TIM1_CH4 O 18 Timer 1 channel 4 output
TIM1_CH4 I 18 Timer 1 channel 4 input
REG_EN O 18 External regulator open drain output (enabled after reset)
26
PC5 I/O 11 Digital I/O
TX_ACTIVE O 11 Logic level control for external Rx/Tx switch
Table 1. Pin description (continued)
Module pin n° Pin name Direction STM32W pin Description
SPZB32W1x2.1 Electrical characteristics
Doc ID 018899 Rev 2 11/19
6 Electrical characteristics
6.1 Absolute maximum ratings
6.2 Recommended operating conditions
6.3 DC electrical characteristics
Table 2. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
V
DD
Module supply voltage - 0.3 3.6 V
V
in
Input voltage on any digital pin - 0.3 Vdd + 0.3 V
T
stg
Storage temperature -40 +85 °C
T
sold
Soldering temperature < 10s 250 °C
Table 3. Recommended operating conditions
Symbol Parameter Conditions Min. Typ. Max. Unit
V
DD
Module supply voltage -40 °C < T < +85 °C 2.8 3.3 3.6 V
T
stg
Operating ambient temperature -40 +85 °C
Table 4. DC electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
IRX RX current Vdd = 3.3 V, T= 25 °C - 28 - mA
ITX TX current
Po = 3 dBm, Vdd = 3.3 V,
T = 25 °C, F = 2450MHz
- 32 - mA
IDS
Deep sleep current
(32.768 kHz oscillator)
Vdd = 3.3 V, T = 25 °C - 1.3 - µA
Electrical characteristics SPZB32W1x2.1
12/19 Doc ID 018899 Rev 2
6.4 Digital I/O specifications
6.5 RF electrical characteristics
Table 5. Digital I/O specifications
Symbol Parameter Conditions Min. Typ. Max. Unit
V
IL
Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd V
V
IH
High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd V
I
il
Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA
I
ih
Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA
R
ipu
Input pull-up resistor 30 k
R
ipd
Input pull-down resistor 30 k
V
OL
Low level output voltage 0 0.18 x Vdd V
V
OH
High level output voltage 0.82 x Vdd Vdd V
I
OHS
Output source current (standard) 4 mA
I
OLS
Output sink current (standard) 4 mA
I
OHH
Output source current (high current) 8 mA
I
OLH
Output sink current (high current) 8 mA
I
OTot
Total output current for I/O 40 mA
Table 6. Electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
Frequency range Vdd = 3.3 V, T= 25 °C 2405 2480 MHz
TX Output power Vdd = 3.3 V, T= 25 °C 3 6 dBm
RX Sensitivity Vdd = 3.3 V, 1 % PER -95 - 97 dBm
Adjacent channel rejection
±5 MHz
±10 MHZ
35
40
dBm

SPZB32W1A2.1

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
RF TXRX MODULE 802.15.4 CHIP ANT
Lifecycle:
New from this manufacturer.
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