MCP1630/MCP1630V
DS21896C-page 16 2004-2013 Microchip Technology Inc.
5.0 APPLICATION
CIRCUITS/ISSUES
5.1 Typical Applications
The MCP1630/V high-speed PWM can be used for any
circuit topology and power-train application when
combined with a microcontroller. Intelligent, cost-
effective power systems can be developed for applica-
tions that require multiple outputs, multiple phases,
adjustable outputs, temperature monitoring and
calibration.
5.2 NiMH Battery Charger Application
A typical NiMH battery charger application is shown in
the “Typical Application Circuit – MCP1630” of this
data sheet. In that example, a Single-Ended Primary
Inductive Converter (SEPIC) is used to provide a
constant charge current to the series-connected
batteries. The MCP1630 is used to regulate the charge
current by monitoring the current through the battery
sense resistor and providing the proper pulse width.
The PIC16F818 monitors the battery voltage to provide
a termination to the charge current. Additional features
(trickle charge, fast charge, overvoltage protection,
etc.) can be added to the system using the programma-
bility of the microcontroller and the flexibility of the
MCP1630.
5.3 Bidirectional Power Converter
A bidirectional Li-Ion charger/buck regulator is shown
in the “Typical Application Circuit” of the this data
sheet. In this example, a synchronous, bidirectional
power converter example is shown using the
MCP1630V. In this application, when the ac-dc input
power is present, the bidirectional power converter is
used to charge 4-series Li-Ion batteries by boosting the
input voltage. When ac-dc power is removed, the
bidirectional power converter bucks the battery voltage
down to provide a dc bus for system power. By using
this method, a single power train is capable of charging
4-series cell Li-Ion batteries and efficiently converting
the battery voltage down to a low, usable voltage.
5.4 Multiple Output Converters
By using additional MCP1630 devices, multiple output
converters can be developed using a single MCU. If a
two-output converter is desired, the MCU can provide
two PWM outputs that are phased 180° apart. This will
reduce the input ripple current to the source and
eliminate beat frequencies.
2004-2013 Microchip Technology Inc. DS21896C-page 17
MCP1630/MCP1630V
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP
Example:
XXXXX
YWWNNN
1630E
522256
Example:
1630VE
522256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
8-Lead DFN (2 mm x 3 mm)
Example:
XXX
YWW
NN
ABC
522
25
For DFN samples, contact your Microchip Sales Office for availability..
MCP1630/MCP1630V
DS21896C-page 18 2004-2013 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0.23
0.40
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15° -
15° -
JEDEC Equivalent: MO-187
-
-
-
15°
15°
--
-
-
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

MCP1630T-E/MS

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Switching Controllers Hi Spd PWM PIC atach
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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