Reference only
ESKY03D
14 / 20
The cheese-cloth should not be on
fire.
The capacitors should be individually wrapped in
at least one but more than two complete layers of
cheese-cloth. The capacitor should be subjected
to 20 discharges. The interval between successive
discharges should be 5 s. The UAc should be
maintained for 2min after the last discharge.
C1,2 : 1µF±10%, C3 : 0.033µF±5% 10kV
L1 to L4 : 1.5mH±20% 16A Rod core choke
R : 100Ω±2%, Ct : 3µF±5% 10kV
UAc : UR ±5% UR : Rated working voltage
Cx : Capacitor under test
F : Fuse, Rated 10A
Ut : Voltage applied to Ct
terminations
Lead wire should not cut off.
Capacitor should not be broken.
Fix the body of capacitor, apply a tensile weight
gradually to each lead wire in the radial direction of
capacitor up to 10N and keep it for 10±1 s.
With the termination in its normal position, the
capacitor is held by its body in such a manner that
the axis of the termination is vertical; a mass
applying a force of 5N is then suspended from the
end of the termination.
The body of the capacitor is then inclined,
within a period of 2 to 3 s, through an angle of
about 90° in the vertical plane and then
returned to its initial position over the same period
of time; this operation constitutes one bend.
One bend immediately followed by a second bend
in the opposite direction.
resistance
The capacitor should be firmly soldered to the
supporting lead wire and vibration which is 10 to
55Hz in the vibration frequency range,1.5mm in
total amplitude, and about 1min in the rate of
vibration change from 10Hz to 55Hz and back to
10Hz is applied for a total of 6 h; 2 h each in
3 mutually perpendicular directions.
Within the specified tolerance.
400+20C*
2
min.(30pF under)
Char. B, E : 2.5% max.
Char. F : 5.0% max.
Lead wire should be soldered with
uniformly coated on the axial
direction over 3/4 of the
circumferential direction.
The lead wire of a capacitor should be dipped into
a ethanol solution of 25wt% rosin and then into
molten solder for 2±0.5 s. In both cases the depth
of dipping is up to about 1.5 to 2.0mm from the
root of lead wires.
Temp. of solder :
245±5°C Lead Free Solder (Sn-3Ag-0.5Cu)
235±5°C H63 Eutectic Solder
*
2
"C" expresses nominal capacitance value(pF)
