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CB028B0104JBA

P1-P3P4-P6P7-P8
42
Film Chip Capacitors
PPS DIELECTRIC – CB Series
CAPACITANCE VALUES (CR) AND NOMINAL VOLTAGES (VR)
VOLTAGE Vdc: 50V Vac: 40V
Capacitance
Chip Dimensions
Reel
Range
Ordering *Tolerances Tape Dimensions Reel Dimensions Packaging Unit
Pkg
(CR)
Code (page 6)
Code
L W H max T W P1 K0 A W1 W2 max Bulk Reel
0.027 CB028D0273+ -- 3.30 2.50 2.10 0.50 8.00 4.00 2.30 180 8.40 14.4 2000 2000 BA
(0.130) (0.098) (0.083) (0.020) (0.315) (0.158) (0.091) (7.087) (0.331) (0.567)
0.033 CB028D0333+ -- 3.30 2.50 2.10 0.50 8.00 4.00 2.30 180 8.40 14.4 2000 2000 BA
(0.130) (0.098) (0.083) (0.020) (0.315) (0.158) (0.091) (7.087) (0.331) (0.567)
0.039 CB028D0393+ -- 3.30 2.50 2.1 0.50 8.00 4.00 2.30 181 8.40 14.4 2000 2000 BA
(0.130) (0.098) (0.083) (0.020) (0.315) (0.158) (0.091) (7.087) (0.331) (0.567)
0.047 CB038D0473+ -- 4.50 3.20 2.4 0.60 12.0 8.00 2.60 180 12.4 18.4 1500 900 BA
(0.1777) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (7.087) (0.488) (0.724)
4.50 3.20 2.4 0.60 12.0 8.00 2.60 330 12.4 18.4 1500 3600 BC
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (12.99) (0.488) (0.724)
0.056 CB038D0563+ -- 4.50 3.20 2.40 0.60 12.0 8.00 2.60 180 12.4 18.4 1500 900 BA
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (7.087) (0.488) (0.724)
4.50 3.20 2.40 0.60 12.0 8.00 2.60 330 12.4 18.4 1500 3600 BC
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (12.99) (0.488) (0.724)
0.068 CB038D0683+ -- 4.50 3.20 2.40 0.60 12.0 8.00 2.60 180 12.4 18.4 1500 900 BA
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (7.087) (0.488) (0.724)
4.50 3.20 2.40 0.60 12.0 8.00 2.60 330 12.4 18.4 1500 3600 BC
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (12.99) (0.488) (0.724)
0.082 CB038D0823+ -- 4.50 3.20 2.40 0.60 12.0 8.00 2.60 180 12.4 18.4 1500 900 BA
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (7.087) (0.488) (0.724)
4.50 3.20 2.40 0.60 12.0 8.00 2.60 330 12.4 18.4 1500 3600 BC
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (12.99) (0.488) (0.724)
0.100µF CB038D0104+ -- 4.50 3.20 2.40 0.60 12.0 8.00 2.60 180 12.4 18.4 1500 900 BA
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (7.087) (0.488) (0.724)
4.50 3.20 2.40 0.60 12.0 8.00 2.60 330 12.4 18.4 1500 3600 BC
(0.177) (0.126) (0.095) (0.024) (0.472) (0.315) (0.102) (12.99) (0.488) (0.724)
millimeters (inches)
For other Values: upon request
Replace the + by the tolerance code: G = 2%, J = 5% or K = 10%
Replace the -- by the packaging suffix: -- = bulk
BA or BC = tape & reel
W
L
H
T
43
Film Chip Capacitors
PPS DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 1206 to 1812 :150 to 200µm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type Ref. Spec. Test Conditions Analysis Results
Temperature cycling JESD22-A104
-55°C +85(+10/-0)°C air
SEM x 1000 Pass
5 to 10 minutes soak 3 cycles/hour
Ambient Temperature /
30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass
Humidity Storage
High Temperature /
70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass
Humidity Storage
Size Code Case Size A B C
01 1206 1.30 (0.051) 1.30 (0.051) 2.20 (0.087)
02 1210 2.00 (0.079) 1.30 (0.051) 2.20 (0.087)
03 1812 3.00 (0.118) 1.50 (0.059) 3.50 (0.137)
PAD DIMENSIONS: millimeters (inches)
A
CB
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below.
They are NOT suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature 1206 to 1812
Ramp-Up (T
s
max to T
p
) 3°C / second max
Preheat
- Temperature Min (T
s
min) 150°C
- Temperature Min (T
s
max) 200°C
- Time (t
s
min to t
s
max) 180 sec. max
Time maintained above
- Temperature (T
L
) 217°C
- Time (t
L
) 90 sec. max
Peak temperature (T
p
) 260°C
Time within 5°C of peak
10 sec.
temperature (t
p
)
Ramp-Down 6°C / sec.
030
Time (seconds)
Temperature (ºC)
60 90 120 150 180 210 240
Ramp
down
Ramp up
270 300 330
T
p
T
p
- 5ºC
T
s min
T
s max
T
L
t
S
t
p
t
L
44
Film Chip Capacitors
PPS DIELECTRIC – CB Series
ELECTRICAL CHARACTERISTICS VERSUS TEMPERATURE AND FREQUENCY
ELECTRICAL CHARACTERISTICS
3
2
1
0
-1
-2
-3
DC/C (%)
Temp. (°C)
-75 -50 -25 0 25 50 75 100 125 150
-75 -50 -25 0 25 50 75 100 125 150
Temperature (°C)
RIS = f(F)
RIS (G.ohm)
CB01 / 10NF
CB01 / 39NF
CB02 / 100NF
10000
1000
100
10
1
50
45
40
30
25
20
15
10
5
0
TGTE=f(T)
-75 -50 -25 0 25 50 75 100 125 150
Temperature (°C)
TGTE=(10
-4
)
Capacitance
Dissipation Factor
Insulation Resistance
FREQUENCY CHARACTERISTICS
1 10 100 1000 10000
Frequency (kHz)
DC/C = f(F)
25
20
15
10
5
0
-5
DC/C (%)
CB01 / 10NF
CB01 / 39NF
CB02 / 100NF
1000 10000
Frequency (kHz)
Z = f(F)
10,000
1,000
0.100
0.010
Z (Ohms)
CB02 8B 0104 J
1 10 100 1000 10000
Frequency (kHz)
TGTE = f(F)
10
9
8
7
6
5
4
3
2
1
0
TGTE (%)
CB01 / 10NF
CB01 / 39NF
CB02 / 100NF
Capacitance
Dissipation Factor
Impedance
P1-P3P4-P6P7-P8

CB028B0104JBA

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Description:
Film Capacitors 16volts .1uF 5%
Lifecycle:
New from this manufacturer.
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