Light Touch Switches/EVPAA
φ3.3 to φ3.7
0.3 mm max.
Switch
Mounting surface
Test pole
Leaning angle range
90 ˚±4 ˚
(
vertical direction
)
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
Feeding hole
Chip component
Tape running direction
Chip pocket
F
W
E
Tape width=12.0 mm
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
● Embossed Carrier Taping
■ Recommended Reflow Soldering Conditions
Part No. Height A B W F E P1 P2 P0 D0 Dia t1 t2
EVPAA 1.7 4.5±0.2 3.8±0.2 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.3±0.1 1.85±0.20
0
Unit: mm
■ Recommended Shape of Test Pole ■ Recommended Operating Conditions
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
ANCTB18E 201612-Fd
Panasonic Corporation 2016
Panasonic Corporation
Electromechanical Control Business Division
–4–
industrial.panasonic.com/ac/e/
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1. ON at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
ANCTB4_12_18_19.indb 20 16/12/22 13:05
