Model 1P620
Rev C
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal
coefficient of expansion (CTE) of 17-25 ppm/
o
C.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: Xinger products are available
in either an immersion tin or tin-lead finish. Commonly
used storage procedures used to control oxidation should
be followed for these surface mount components. The
storage temperatures should be held between 15
O
C and
60
O
C.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
1P620* Rev A Mounting Footprint
Dimensions are in Inches [Millimeters]
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder connection underneath the part
4X .063 SQ
[1.60]
.170
[4.32]
Multiple
plated thru holes
to ground
.120
[3.05]
4X .034
[0.86]
4X 50
Ω
Transmission
Line
