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73M1922-DB

P1-P3P4-P6P7-P9P10-P12P13-P15
73M1922 Demo Board User Manual UM_1922_006
4 Rev. 5.1
Figures
Figure 1: MicroDAA System Block Diagram
............................................................................................. 5
Figure 2: 73M1922 MicroDAA 20-Pin TSSOP Demo Board Schematic Diagram
...................................... 8
Figure 3: 73M1922 20-Pin TSSOP Demo Board: Top Signal Layer
.......................................................... 9
Figure 4: 73M1922 20-Pin TSSOP Demo Board: Layer 2, Ground Plane
................................................. 9
Figure 5: 73M1922 20-Pin TSSOP Demo Board: Layer 3, Supply Plane
................................................ 10
Figure 6: 73M1922 20-Pin TSSOP Demo Board: Bottom Signal Layer
................................................... 10
Figure 7: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Top
.......................................................... 11
Figure 8: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Bottom
..................................................... 11
Figure 9: 73M1902/73M1912 20-Pin TSSOP Packages: Pinout (top view)
............................................. 15
Tables
Table 1: 73M1922 Demo Board Connectors
............................................................................................ 7
Table 2: 73M1922 Demo Board Configuration Settings
............................................................................ 7
Table 3: JS1 Host Interface Connector
..................................................................................................... 7
Table 4: 73M1922 20-Pin TSSOP Demo Board Bill of Materials
............................................................. 13
Table 5: 73M1902 HIC 20-Pin TSSOP Package Pin Definitions
............................................................. 14
Table 6: 73M1912 LIC 20-Pin TSSOP Package Pin Definitions
.............................................................. 14
UM_1922_006 73M1922 Demo Board User Manual
Rev. 5.1 5
1 Introduction
The 73M1922 MicroDAA Chipset Demo Board integrates silicon Data Access Arrangement (DAA)
function along with Analog Front End functions chipsets for worldwide compliance.
The 73M1922 MicroDAA chipset consists of a 73M1902 and a 73M1912. The 73M1902 is the Host
Interface Chip (HIC) providing a host microprocessor or DSP interface by a synchronous serial port
(Modem Analog Front End (MAFE)) and the 73M1912 is the Line Interface Chip (LIC) to connect to a
telephone line.
The 73M1922 chipset is packaged in two 20-pin TSSOP or two 32-pin QFN packages for a very small
physical dimension and offers low cost global DAA design.
73M
1902
73M
1912
L
I
N
E
I
N
T
E
R
F
A
C
E
H
O
S
T
I
N
T
E
R
F
A
C
E
73M1922
Host Interface
Chip (Circuitry)
Line Interface
Chip (Circuitry)
GPIO
FS
FSB
SCLK
SDIN
SDOUT
TYPE
M/S
INT/RGDT
OSCIN
OSCOUT
RGP
RGN
OFH
DCI
DCB
DCE
TXN
RXM
RXP
SRE
ACS
SRB
DCD
PULSE
TRANSFORMER
SCKM
AOUT
Shaded pins and names are optional depending on packages
Figure 1: MicroDAA System Block Diagram
The 73M1922 performs a modem codec function that interfaces a Host/DSP and the PSTN (Public
Switched Telephone Network). The codec supports data rates up to V.92 with call progress signaling. In
addition to the codec function, the 73M1922 MicroDAA chipset also performs other necessary DAA
functions, such as CID (caller identification), ring detection, tip/ring polarity reversal detection, on/off hook
switch control, pulse dialing, regulation of loop current (DC-IV), line impedance matching, line in use and
parallel pickup detection.
All data and control information between the LIC and the HIC is transferred across a low cost pulse
transformer barrier. Also all clock and synchronization information needed in LIC is embedded in this
data and control bit stream across the barrier transformer received from HIC and reconstructed within
LIC. The LIC interface to tip/ring of the PSTN significantly lowers the number of external components and
their cost.
The DAA feature integrated in this chipset offers a configurable US, ETSI ES 203 021-2, or other World
Wide DAA capability to the telephone line interface and an auxiliary DAC with gain control for line
monitoring during the call progress period.
73M1922 Demo Board User Manual UM_1922_006
6 Rev. 5.1
1.1 Package Contents
The 73M1922 Demo Board Kit includes:
• A 73M1922 Demo Board (Rev. D1)
• The following documents on CD:
• 73M1922 Demo Board User Manual (this document)
• 73M1822/73M1922 Data Sheet
• 73M1822/73M1922 Layout Guideline
• 73M1x22 Worldwide Design Guide
1.2 Safety and ESD Notes
Connecting live voltages to the Demo Board system will result in potentially hazardous voltages on the
boards.
Extreme caution should be taken when handling the Demo Boards after connection to
live voltages!
The Demo Boards are ESD sensitive! ESD precautions should be taken when handling
these boards!
1.3 Demo Board Options
The 73M1922 Demo Board has 20-pin right angle connectors to plug on to a target DSP or CPU system.
Each has a 3.3 V power receptacle for powering on-board circuits from target system or external power
supply, or power can be supplied through the 20-pin connector along with the other signals. The
73M1922 Demo Board allows the evaluation of the 73M1922 chipset for universal modem, voice
application and interface to a general DSP or CPU system use.
P1-P3P4-P6P7-P9P10-P12P13-P15

73M1922-DB

Mfr. #:
Buy 73M1922-DB
Manufacturer:
Maxim Integrated
Description:
Networking Development Tools 73M1922 Demo Brd
Lifecycle:
New from this manufacturer.
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