PART NUMBER UPC8163TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX
ICC Circuit Current (no signal) mA 11.5 16.5 23
CG Conversion Gain fRFOUT = 0.9 GHz, PIFIN = -30 dBm dB 6 9 12
fRFOUT = 1.9 GHz, PIFIN = -30 dBm dB 4 7 10
PSAT Saturated Output Power fRFOUT = 0.9 GHz dBm -1.5 0.5
fRFOUT = 1.9 GHz dBm -4.5 -2
OIP3 Output third Order Intercept Point,
fIFIN1 = 240 MHz
fIFIN2 = 240.4 MHz fRFOUT = 0.9 GHz dBm +9.5
PIFIN = -20 dBm fRFOUT = 1.9 GHz dBm +6.0
NF SSB Noise Figure fRFOUT = 0.9 GHz dB 12.5
fRFOUT = 1.9 GHz dB 12.5
• RECOMMENDED OPERATING FREQUENCY:
f
RFOUT = 0.8 GHz to 2.0 GHz
fIFIN = 50 MHz to 300 MHz
• SUPPLY VOLTAGE:
VCC = 2.7 to 3.3 V
• HIGH DENSITY SURFACE MOUNTING:
6-pin super minimold package
• HIGH IP3:
OIP
3 = +9.5 dBm @ fRFOUT = 900 MHz
• MINIMIZED CARRIER LEAKAGE:
Due to double balanced mixer
FEATURES
3 V SILICON RFIC
FREQUENCY UPCONVERTER
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VRFOUT = 3.0 V, fIFIN = 240 MHz, PLOIN = -5 dBm unless otherwise specified)
DESCRIPTION
California Eastern Laboratories
UPC8163TB
NEC's UPC8163TB is a silicon RFIC designed as a frequency
upconverter for cellular/cordless telephone transmitter stages,
and features improved intermodulation. This device is housed
in a 6 pin super mini mold or SOT-363 package making it ideal
for reducing system size. The UPC8106TB is manufactured
using NEC's 20 GHz f
T NESAT
TM
III silicon bipolar pro-
cess.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
LO input
GND
IF input
GND
V
CC
RF output
(Top View)
3
2
1
4
5
6
BLOCK DIAGRAM
APPLICATIONS
• Digital Cellular/Cordless Phones
