Nexperia
BAW56SRA
Quad high-speed switching diodes
BAW56SRA All information provided in this document is subject to legal disclaimers.
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Nexperia B.V. 2017. All rights reserved
Product data sheet 26 June 2017 4 / 12
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - - 305 K/WR
th(j-a)
thermal resistance
from junction to
ambient
in free air
[2] - - 205 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
[3] - - 40 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm
2
.
[3] Soldering point of anode tab.
aaa-025767
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
0
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
FR4 PCB, standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-025766
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.01
0
0.02
0.05
0.1
0.33
0.2
0.25
0.5
0.75
FR4 PCB, mounting pad for cathode 1 cm²
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
