13
The important parameters for the bulk input capacitance are
the voltage rating and the RMS current rating. For reliable
operation, select bulk capacitors with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. Their voltage rating should be
at least 1.25 times greater than the maximum input voltage,
while a voltage rating of 1.5 times is a conservative
guideline. For worst cases, the RMS current rating
requirement for the input capacitor of a buck regulator is
approximately 1/2 the DC output load current.
The maximum RMS current required by the regulator may be
closely approximated through the following equation:
For a through hole design, several electrolytic capacitors
may be needed. For surface mount designs, solid tantalum
capacitors can be used, but caution must be exercised with
regard to the capacitor surge current rating. These
capacitors must be capable of handling the surge-current at
power-up. Some capacitor series available from reputable
manufacturers are surge current tested.
MOSFET Selection - PWM Buck Converter
The ISL6532B requires 2 N-Channel power MOSFETs for
switching power and a third MOSFET to block backfeed from
V
DDQ
to the Input in S3 Mode. These should be selected
based upon r
DS(ON)
, gate supply requirements, and thermal
management requirements.
In high-current applications, the MOSFET power dissipation,
package selection and heatsink are the dominant design
factors. The power dissipation includes two loss
components; conduction loss and switching loss. The
conduction losses are the largest component of power
dissipation for both the upper and the lower MOSFETs.
These losses are distributed between the two MOSFETs
according to duty factor. The switching losses seen when
sourcing current will be different from the switching losses
seen when sinking current. When sourcing current, the
upper MOSFET realizes most of the switching losses. The
lower switch realizes most of the switching losses when the
converter is sinking current (see the equations below).
These equations assume linear voltage-current transitions
and do not adequately model power loss due the reverse-
recovery of the upper and lower MOSFET’s body diode. The
gate-charge losses are dissipated in part by the ISL6532B
and do not significantly heat the MOSFETs. However, large
gate-charge increases the switching interval, tSW which
increases the MOSFET switching losses. Ensure that both
MOSFETs are within their maximum junction temperature at
high ambient temperature by calculating the temperature
rise according to package thermal-resistance specifications.
A separate heatsink may be necessary depending upon
MOSFET power, package type, ambient temperature and air
flow.
I
RMS
MAX
V
OUT
V
IN
----------------
I
OUT
MAX
2
1
12
------
V
IN
V
OUT
Lf
sw
×
------------------------------- -
V
OUT
V
IN
----------------
×



2
×+



×=
P
LOWER
= Io
2
x r
DS(ON)
x (1 - D)
Where: D is the duty cycle = V
OUT
/ V
IN
,
t
SW
is the combined switch ON and OFF time, and
f
s
is the switching frequency.
Approximate Losses while Sourcing current
Approximate Losses while Sinking current
P
LOWER
Io
2
r
DS ON()
× 1D()×
1
2
---
Io V
IN
× t
SW
f
s
××+=
P
UPPER
Io
2
r
DS ON()
× D×
1
2
---
Io V
IN
× t
SW
f
s
××+=
P
UPPER
= Io
2
x r
DS(ON)
x D
ISL6532B
14
ISL6532B Application Circuit
Figure 7 shows an application circuit utilizing the ISL6532B.
Detailed information on the circuit, including a complete Bill-
of-Materials and circuit board description, can be found in
Application Note AN1055.
FIGURE 7. DDR SDRAM AND AGP VOLTAGE REGULATOR USING THE ISL6532B
10.0k
1µF
5VSBY
UGATE
FB
COMP
ISL6532B
C
17,18
LGATE
VCC12
VTT
VTT
+
V
TT
VREF_IN
VREF_OUT
VTTSNS
PGOOD
+3.3V
V
DDQ
Q
1,3
2.5V
+
+
Q
2,4
VCC5
NCH
GND
V
REF
V
DDQ
Q
5
VDDQ
VDDQ
GND
5VSBY
P5VSBY
P12V
S5
S3
SLP_S5#
SLP_S3#
PGOOD
C
16
R
2
1µF
L
1
2.1µH
L
2
2.1µH
4.99k
R
1
C
19
0.47µF
C
6-8
C
9-12
1800µF
22µF
6.8nF
C
14
825
R
6
C
15
C
13
R
5
R
4
R
3
22.6
1.74k
19.1k
56nF
1000pF
1.25V
+
V
DDQ
C
20
220µF
C
21
220µF
C
26
0.1µF
C
27
0.1µF
C
1-3
2200µF
C
4,5
1µF
ISL6532B
15
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL6532B
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L20.6x6
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VJJB ISSUE C)
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.80 0.90 1.00 -
A1 - - 0.05 -
A2 - - 1.00 9
A3 0.20 REF 9
b 0.28 0.33 0.40 5, 8
D 6.00 BSC -
D1 5.75 BSC 9
D2 3.55 3.70 3.85 7, 8
E 6.00 BSC -
E1 5.75 BSC 9
E2 3.55 3.70 3.85 7, 8
e 0.80 BSC -
k0.25 - - -
L 0.35 0.60 0.75 8
L1 - - 0.15 10
N202
Nd 5 3
Ne 5 3
P- -0.609
θ --129
Rev. 1 10/02
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.

ISL6532BCRZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers DL DDRG W/3ALDO FOR SPRINGDALE MBS 20
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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