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MURHB860CTT4G

P1-P3P4-P4
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 3
1 Publication Order Number:
MURHB860CT/D
MURHB860CT
Power Rectifier
D
2
PAK Power Surface Mount Package
Designed for use in switching power supplies, inverters and as free
wheeling diodes, these state−of−the−art devices have the following
features:
Features
• Package Designed for Power Surface Mount Applications
• Ultrafast 35 Nanosecond Recovery Times
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• High Temperature Glass Passivated Junction
• High Voltage Capability to 600 V
• Low Leakage Specified @ 150°C Case Temperature
• Short Heat Sink Tab Manufactured — Not Sheared!
• Similar in Size to Industry Standard TO−220 Package
• Case: Epoxy, Molded
• Weight: 1.7 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Pb−Free Packages are Available
MAXIMUM RATINGS (Per Leg)
Rating
Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
600 V
Average Rectified Forward Current
(Rated V
R
, T
C
= 120°C) Total Device
I
F(AV)
4.0
8.0
A
Peak Repetitive Forward Current
(Rated V
R
, Square Wave, 20 kHz,
T
C
= 120°C)
I
FM
8.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single Phase,
60 Hz)
I
FSM
100 A
Operating Junction and Storage
Temperature Range
T
J
, T
stg
−65 to +175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping
†
ORDERING INFORMATION
MURHB860CT D
2
PAK
D
2
PAK
CASE 418B
STYLE 3
50 Units/Rail
3
4
1
ULTRAFAST RECTIFIER
8.0 AMPERES, 600 VOLTS
1
3
4
MURHB860CTT4 D
2
PAK 800/Tape & Reel
MARKING DIAGRAM
MURHB860CTT4G D
2
PAK
(Pb−Free)
800/Tape & Reel
MURHB860CTG D
2
PAK
(Pb−Free)
50 Units/Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
AKA = Diode Polarity
http://onsemi.com
AY WW
UH860G
AKA
MURHB860CT
http://onsemi.com
2
THERMAL CHARACTERISTICS (Per Leg)
Rating
Symbol Value Unit
Maximum Thermal Resistance, Junction−to−Case
R
q
JC
3.0 °C/W
Maximum Thermal Resistance, Junction−to−Ambient
R
q
JA
50 °C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Symbol Max Unit
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 4.0 A, T
C
= 150°C)
(i
F
= 4.0 A, T
C
= 25°C)
v
F
2.5
2.8
V
Maximum Instantaneous Reverse Current (Note 1)
(Rated DC Voltage, T
C
= 150°C)
(Rated DC Voltage, T
C
= 25°C)
i
R
500
10
mA
Maximum Reverse Recovery Time (I
F
= 1.0 A, di/dt = 50 A/ms)
t
rr
35 ns
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%
MURHB860CT
http://onsemi.com
3
PACKAGE DIMENSIONS
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
C 0.160 0.190 4.06 4.83
D 0.020 0.035 0.51 0.89
E 0.045 0.055 1.14 1.40
G 0.100 BSC 2.54 BSC
H 0.080 0.110 2.03 2.79
J 0.018 0.025 0.46 0.64
K 0.090 0.110 2.29 2.79
S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F 0.310 0.350 7.87 8.89
L 0.052 0.072 1.32 1.83
M 0.280 0.320 7.11 8.13
N 0.197 REF 5.00 REF
P 0.079 REF 2.00 REF
R 0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE
R
N P
U
VIEW W−W VIEW W−W VIEW W−W
123
D
2
PAK 3
CASE 418B−04
ISSUE K
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.49
3.504
P1-P3P4-P4

MURHB860CTT4G

Mfr. #:
Buy MURHB860CTT4G
Manufacturer:
ON Semiconductor
Description:
Rectifiers 600V 8A Ultrafast
Lifecycle:
New from this manufacturer.
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