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UDQ2559LBTR-T

P1-P3P4-P6P7-P8
Protected Quad Power Driver
2559
4
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
P
D
= (V
OUT1
x I
OUT1
x dc) + … + (V
OUTn
x I
OUTn
x dc)
+ (V
CC
x I
CC
) = (T
J
- T
A
)/R
JA
Copyright © 1995, 2002 Allegro MicroSystems, Inc.
Thermal Characteristics
Characteristic Symbol Test Conditions* Value Units
Package Thermal Resistance
R
θJA
Package B, 2-layer PCB with 0.5 in.
2
exposed copper each side 43 ºC/W
Package EB, 1-layer PCB with copper limited to solder pads 36 ºC/W
Package LB, 1-layer PCB with copper limited to solder pads 90 ºC/W
*Additional thermal information available on the Allegro website
Protected Quad Power Driver
2559
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS at T
A
= +25°C (prefi x ‘UDN’) or over operating
temperature range (prefi x ‘UDK’ or ‘UDQ’), V
CC
= 4.75 V to 5.25 V
Limits
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Output Leakage Current I
CEX
V
OUT
= 50 V, V
IN
= 0.8 V, V
EN
= 2.0 V — <1.0 100 μA
V
OUT
= 50 V, V
IN
= 2.0 V, V
EN
= 0.8 V — <1.0 100 μA
Output Sustaining Voltage V
OUT(SUS)
I
OUT
= 100 mA, V
IN
= V
EN
= 0.8 V 40 — — V
Output Saturation Voltage V
OUT(SAT)
All Devices, I
OUT
= 100 mA — — 300 mV
All Devices, I
OUT
= 400 mA — — 500 mV
B or EB package only, I
OUT
= 600 mA — — 700 mV
Over-Current Trip I
TRIP
— 1.0 — A
Input Voltage Logic 1 V
IN(1)
or V
EN(1)
2.0 — — V
Logic 0 V
IN(0)
or V
EN(0)
— — 0.8 V
Input Current Logic 1 V
IN(1)
or V
EN(1)
= 2.0 V — — 40 μA
Logic 0 V
IN(0)
or V
EN(0)
= 0.8 V
— — -10 μA
Total Supply Current* I
CC
All Outputs ON, V
IN
= V
EN
= 2.0 V — — 80 mA
All Outputs OFF — — 5.0 mA
Clamp Diode Forward Voltage V
F
I
F
= 1.0 A — — 1.7 V
I
F
= 1.5 A — — 2.1 V
Clamp Diode Leakage Current I
R
V
R
= 50 V, D
1
+ D
2
or D
3
+ D
4
— — 50 μA
Turn-On Delay t
PHL
I
OUT
= 500 mA — — 20 μs
t
PLH
I
OUT
= 500 mA — — 20 μs
Thermal Limit T
J
— 165 — °C
Typical Data is for design information only.
Negative current is defi ned as coming out of (sourcing) the specifi ed terminal.
As used here, -100 is defi ned as greater than +10 (absolute magnitude convention) and the minimum is implicitly zero.
* All inputs simultaneously, all other tests are performed with each input tested separately.
Protected Quad Power Driver
2559
6
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TYPICAL OUTPUT
CHARACTERISTIC
CIRCUIT DESCRIPTION AND APPLICATION
INCANDESCENT LAMP DRIVER
High incandescent lamp turn-ON/in-rush currents can contribute to poor
lamp reliability and destroy semiconductor lamp drivers. Warming or current-
limiting resistors protect both driver and lamp but use signifi cant power either
when the lamp is OFF or when the lamp is ON, respectively. Lamps with
steady-state current ratings up to 700 mA can be driven by these devices with-
out the need for warming (parallel) or current-limiting (series) resistors.
When an incandescent lamp is initially turned ON, the cold fi lament is
at minimum resistance and would normally allow a 10x to 12x in-rush cur-
rent. With these drivers, during turn-ON, the high in-rush current is sensed by
the internal low-value sense resistor. Drive current to the output stage is then
diverted by the shunting transistor, and the load current is momentarily limited
to approximately 1.0 A. During this short transition period, the output cur-
rent is reduced to a value dependent on supply voltage and fi lament resistance.
During lamp warmup, the fi lament resistance increases to its maximum value,
the output stage goes into saturation and applies maximum rated voltage to the
lamp.
INDUCTIVE LOAD DRIVER
Bifi lar (unipolar) stepper motors, relays, or solenoids can be driven di-
rectly. The internal fl yback diodes prevent damage to the output transistors by
suppressing the high-voltage spikes that occur when turning OFF an inductive
load.
For rapid current decay (fast turn-OFF speeds), the use of Zener diodes
will raise the fl yback voltage and inprove performance. However, the peak
voltage must not exceed the specifi ed minimum sustaining voltage (V
SUPPLY
+
V
Z
+ V
F
V
OUT(SUS)
).
FAULT CONDITIONS
In the event of a shorted load, the load current will attempt to increase. As
described above, the drive current to the affected output stage is reduced, caus-
ing the output stage to go linear, limiting the peak output current to approxi-
mately 1 A. As the power dissipation of that output stage increases, a thermal
gradient sensing circuit will become operational, further decreasing the drive
current to the affected output stage and reducing the output current to a value
dependent on supply voltage and load resistance.
Continuous or multiple overload conditions causing the chip temperature
to reach approximately 165°C will result in an additional reduction in output
current to maintain a safe level.
If the fault condition is corrected, the output stage will return to its normal
saturated condition.
TYPICAL OUTPUT BEHAVIOR
P1-P3P4-P6P7-P8

UDQ2559LBTR-T

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IC POWER DRVR PROT QUAD 16SOIC
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