NXP Semiconductors Product specification
Rectifier diodes BYW29EX series
ultrafast, rugged
ESD LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
Electrostatic discharge Human body model; - 8 kV
capacitor voltage C = 250 pF; R = 1.5 kΩ
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
R.M.S. isolation voltage from f = 50-60 Hz; sinusoidal - 2500 V
both terminals to external waveform;
heatsink R.H. ≤ 65% ; clean and dustfree
C
isol
Capacitance from both terminals f = 1 MHz - 10 - pF
to external heatsink
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-hs
Thermal resistance junction to with heatsink compound - - 5.5 K/W
heatsink without heatsink compound - - 7.2 K/W
R
th j-a
Thermal resistance junction to in free air - 55 - K/W
ambient
STATIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
Forward voltage I
F
= 8 A; T
j
= 150˚C - 0.80 0.895 V
I
F
= 8 A - 0.92 1.05 V
I
F
= 20 A - 1.1 1.3 V
I
R
Reverse current V
R
= V
RWM
; T
j
= 100 ˚C - 0.2 0.6 mA
V
R
= V
RWM
-210µA
DYNAMIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Q
s
Reverse recovery charge I
F
= 2 A; V
R
≥ 30 V; -dI
F
/dt = 20 A/µs- 4 11 nC
t
rr1
Reverse recovery time I
F
= 1 A; V
R
≥ 30 V; - 20 25 ns
-dI
F
/dt = 100 A/µs
t
rr2
Reverse recovery time I
F
= 0.5 A to I
R
= 1 A; I
rec
= 0.25 A - 15 20 ns
V
fr
Forward recovery voltage I
F
= 1 A; dI
F
/dt = 10 A/µs-1-V
October 1998 2 Rev 1.200