www.vishay.com For technical questions, contact: optocoupleranswers@vishay.com
Document Number: 81331
2 Rev. 1.6, 04-Nov-10
SFH6755T, SFH6756T, SFH6757T
Vishay Semiconductors
High Speed Optocoupler, 10 MBd,
Dual, SOIC-8 Package
Notes
(1)
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(2)
Refer to reflow profile for soldering conditions for surface mounted devices.
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal
Characteristics of Optocouplers application note.
ABSOLUTE MAXIMUM RATINGS
(1)
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
INPUT
Average forward current (single channel)
I
F
20 mA
Average forward current (per channel for dual channel)
I
F
15 mA
Reverse input voltage
V
R
5V
Surge current t = 100 μs
I
FSM
200 mA
Output power dissipation (single channel)
P
diss
35 mW
Output power dissipation (per channel for dual
P
diss
25 mW
OUTPUT
Supply voltage 1 min maximum
V
CC
7V
Output current
I
O
50 mA
Output voltage
V
O
7V
Output power dissipation (single channel)
P
diss
85 mW
Output power dissipation (for dual channel)
P
diss
60 mW
COUPLER
Isolation test voltage t = 1 s
V
ISO
4000 V
RMS
Storage temperature
T
stg
- 55 to + 150 °C
Operating temperature
T
amb
- 40 to + 100 °C
Lead solder temperature for 10 s 260 °C
Solder reflow temperature
(2)
for 1 min
T
sld
260 °C
RECOMMENDED OPERATING CONDITIONS
PARAMETER TEST CONDITION SYMBOL MIN. MAX. UNIT
Operating temperature T
amb
- 40 100 °C
Supply voltage V
CC
4.5 5.5 V
Input current low level I
FL
0250μA
Input current high level I
FH
515mA
Output pull up resistor R
L
330 4K Ω
Fanout R
L
= 1 kΩ N5-
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
LED power dissipation at 25 °C P
diss
100 mW
Output power dissipation at 25 °C P
diss
500 mW
Maximum LED junction temperature T
jmax
125 °C
Maximum output die junction temperature T
jmax
125 °C
Thermal resistance, junction emitter to emitter θ
EE
412 °C/W
Thermal resistance, junction detector to emitter θ
DE
133 °C/W
Thermal resistance, junction emitter to board θ
EB
120 °C/W
Thermal resistance, junction detector to board θ
DB
77 °C/W
Thermal resistance, junction emitter to case θ
EC
110 °C/W
20510
θ
ET
T
E1
T
D
T
C
θ
EE
θ
EB
θ
DB
θ
DE
T
B
T
B
T
B
T
C
T
E2
θ
DE
θ
EB
θ
ET
