HSMS-270P-TR1G

HSMS-2700, 2702, 270B, 270C, 270P
High Performance Schottky Diode
for Transient Suppression
Data Sheet
Features
Ultra-low Series Resistance for Higher Current
Handling
Picosecond Switching
Low Capacitance
Lead-free
Applications
RF and computer designs that require circuit protection,
high-speed switching, and voltage clamping.
Package Lead Code Identification (Top View)
Description
The HSMS-2700 series of Schottky diodes, commonly
referred to as clipping/clamping diodes, are optimal for
circuit and waveshape preservation applications with
high speed switching. Ultra-low series resistance, R
S
,
makes them ideal for protecting sensitive circuit elements
against higher current transients carried on data lines.
With picosecond switching, the HSMS-270x can respond
to noise spikes with rise times as fast as 1 ns. Low ca-
pacitance minimizes waveshape loss that causes signal
degradation.
HSMS-270x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Number
HSMS-
Package
Marking
Code
[2]
Lead
Code Configuration Package
Maximum
Forward
Voltage
V
F
(mV)
Minimum
Breakdown
Voltage
V
BR
(V)
Typical
Capacitance
C
T
(pF)
Typical
Series
Resistance
R
S
(Ω)
Maximum
Eff. Carrier
Lifetime
τ (ps)
-2700 J0 0 Single SOT-23
550
[3]
15
[4]
6.7
[5]
0.65 100
[6]
-270B B
SOT-323
(3-lead SC-70)
-2702 2 SOT-23
-270C J2 C Series
SOT-323
(3-lead SC-70)
-270P JP P Bridge Quad
SOT-363
(6-lead SC-70)
Notes:
1. T
A
= +25°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
R
= 100 μA; 100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 20 mA; guaranteed by design.
SERIES
2, C
SINGLE
0, B
1212123
65433
BRIDGE QUAD
2
Absolute Maximum Ratings, T
A
= 25ºC
Symbol Parameter Unit
Absolute Maximum
[1]
HSMS-2700/-2702 HSMS-270B/270C/270P
I
F
DC Forward Current mA 350 750
I
F-peak
Peak Surge Current (1μs pulse) A 1.0 1.0
P
T
Total Power Dissipation mW 250 825
P
INV
Peak Inverse Voltage V 15 15
T
J
Junction Temperature °C 150 150
T
STG
Storage Temperature °C -65 to 150 -65 to 150
θ
JC
Thermal Resistance, junction to lead °C/W 500 150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
Parameter Unit Value
BV V 25
CJO pF 6.7
EG eV 0.55
IBV A 10E-4
IS A 1.4E-7
N 1.04
RS
Ω
0.65
PB V 0.6
PT 2
M 0.5
SPICE Parameters
R
S
0.08 pF
SPICE model
2 nH
3
Typical Performance
Figure 2. Forward Current vs. Forward Voltage at
Temperature for HSMS-270B and HSMS-270C.
0 0.1 0.30.2 0.50.4 0.6
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs. Forward Voltage at
Temperature for HSMS-2700 and HSMS-2702.
0.01
10
100
1
0.1
300
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C
Figure 3. Junction Temperature vs. Forward Current
as a Function of Heat Sink Temperature for the
HSMS-2700 and HSMS-2702.
Note: Data is calculated from SPICE parameters.
Figure 5. Total Capacitance vs. Reverse Voltage.
0510 20
C
T
– TOTAL CAPACITANCE (pF)
V
F
– REVERSE VOLTAGE (V)
15
1
3
2
7
4
6
5
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C
050 150100 300
250
200
350
T
J
– JUNCTION TEMPERATURE ( C)
I
F
– FORWARD CURRENT (mA)
0
140
120
100
80
60
40
20
160
Max. safe junction temp.
Figure 4. Junction Temperature vs. Current as a
Function of Heat Sink Temperature for HSMS-270B
and HSMS-270C.
Note: Data is calculated from SPICE parameters.
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C
0 150 450300 600 750
T
J
– JUNCTION TEMPERATURE ( C)
I
F
– FORWARD CURRENT (mA)
0
140
120
100
80
60
40
20
160
Max. safe junction temp.
0 0.1 0.30.2 0.50.4 0.80.70.6
I
F
– FORWARD CURRENT (mA)
V
F
– FORWARD VOLTAGE (V)
0.01
10
100
1
0.1
500
T
A
= +75 C
T
A
= +25 C
T
A
= –25 C

HSMS-270P-TR1G

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Schottky Diodes & Rectifiers 15 VBR 6.7 pF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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