MC74HC4051A, MC74HC4052A, MC74HC4053A
http://onsemi.com
13
ORDERING & SHIPPING INFORMATION
Device Package Shipping
MC74HC4051AN PDIP–16 500 Units / Unit Pak
MC74HC4051AD SOIC–16 48 Units / Rail
MC74HC4051ADR2 SOIC–16 2500 Units / Tape & Reel
MC74HC4051ADT TSSOP–16 96 Units / Rail
MC74HC4051ADTR2 TSSOP–16 2500 Units / Tape & Reel
MC74HC4051ADW SOIC WIDE 48 Units / Rail
MC74HC4051ADWR2 SOIC WIDE 1000 Units / Tape & Reel
MC74HC4051AF SOEIAJ–16 See Note 1.
MC74HC4051AFEL SOEIAJ–16 See Note 1.
MC74HC4052AN PDIP–16 500 Units / Unit Pak
MC74HC4052AD SOIC–16 48 Units / Rail
MC74HC4052ADR2 SOIC–16 2500 Units / Tape & Reel
MC74HC4052ADT TSSOP–16 96 Units / Rail
MC74HC4052ADTR2 TSSOP–16 2500 Units / Tape & Reel
MC74HC4052ADW SOIC WIDE 48 Units / Rail
MC74HC4052ADWR2 SOIC WIDE 1000 Units / Tape & Reel
MC74HC4052AF SOEIAJ–16 See Note 1.
MC74HC4052AFEL SOEIAJ–16 See Note 1.
MC74HC4053AN PDIP–16 500 Units / Unit Pak
MC74HC4053AD SOIC–16 48 Units / Rail
MC74HC4053ADR2 SOIC–16 2500 Units / Tape & Reel
MC74HC4053ADT TSSOP–16 96 Units / Rail
MC74HC4053ADTR2 TSSOP–16 2500 Units / Tape & Reel
MC74HC4053ADW SOIC WIDE 48 Units / Rail
MC74HC4053ADWR2 SOIC WIDE 1000 Units / Tape & Reel
MC74HC4053AF SOEIAJ–16 See Note 1.
MC74HC4053AFEL SOEIAJ–16 See Note 1.
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
MC74HC4051A, MC74HC4052A, MC74HC4053A
http://onsemi.com
14
PACKAGE DIMENSIONS
PDIP–16
N SUFFIX
CASE 648–08
ISSUE R
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
10°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
10°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
B
18
916
F
H
G
D
16 PL
S
C
–T
SEATING
PLANE
K
J
M
L
TA0.25 (0.010)
M M
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25
7°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009
7°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–B
D
16 PL
K
C
G
–T
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
SOIC–16
D SUFFIX
CASE 751B–05
ISSUE J
MC74HC4051A, MC74HC4052A, MC74HC4053A
http://onsemi.com
15
PACKAGE DIMENSIONS
SOIC–16 WIDE
DW SUFFIX
CASE 751G–03
ISSUE B
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
0 7
TSSOP–16
DT SUFFIX
CASE 948F–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N

MC74HC4051AD

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Multiplexer Switch ICs 2-6V ANLG Mux/Demux
Lifecycle:
New from this manufacturer.
Delivery:
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