SDMP0340LT /LST /LCT /LAT
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Low Forward Voltage Drop
• Guard Ring Die Construction for Transient Protection
• Ideal for Low Logic Level Applications
• Low Capacitance
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability Classification
Rating: 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagrams Below
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.002 grams (approximate)
Top View
SDMP0340LT SDMP0340LAT SDMP0340LCT SDMP0340LST
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
40 V
RMS Reverse Voltage
V
R(RMS)
28 V
Forward Continuous Current (Note 1)
I
FM
30 mA
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load
I
FSM
200 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
150 mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θ
JA
833
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-40 to +125
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
40
⎯ ⎯
V
I
R =
10uA
Forward Voltage Drop
V
F
⎯
290 370 mV
I
F
= 1mA
Leakage Current (Note 2)
I
R
⎯ ⎯
1.0
μA
V
R
= 10V
Total Capacitance
C
T
⎯
2
⎯
pF
V
R
= 1V, f = 1.0 MHz
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
SDMP0340LT /LST /LCT /LAT
Document number: DS30266 Rev. 11 - 2
1 of 4
www.diodes.com
July 2008
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