ADL5602 Data Sheet
Rev. A | Page 12 of 16
BASIC CONNECTIONS
The basic connections for operating the ADL5602 are shown in
Figure 16. Recommended components are listed in Table 5. The
input and output should be ac-coupled with appropriately sized
capacitors (device characterization was performed with 0.1 μF
capacitors). A 5 V dc bias is supplied to the amplifier through
the bias inductor connected to RFOUT (Pin 3). The bias voltage
should be decoupled using a 1 µF capacitor, a 1.2 nF capacitor,
and a 68 pF capacitor.
RFIN
GND
GND
RFOUT
1
2
3
ADL5602
C6
1µF
L1
470nH
GND
RFIN
RFOUT
(2)
C5
1.2nF
C4
68pF
C2
0.1µF
C1
0.1µF
VCC
08190-015
Figure 16. Basic Connections
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 17 shows the recommended land pattern for the ADL5602.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane
along with Pin 2. If multiple ground layers exist, they should be
stitched together using vias. For more information on land
pattern design and layout, refer to the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
1.50mm
3.00mm
1.27mm
0.62mm
3.48mm
1.80mm
0.86mm
5.37mm
0.20mm
0.762mm 0.635mm
0.86mm
08190-101
Figure 17. Recommended Land Pattern
Table 5. Recommended Components for Basic Connections
Frequency (MHz) C1 C2 L1 C4 C5 C6
50 to 4000 0.1 µF 0.1 µF 470 nH (Coilcraft 0603LS-NX or equivalent) 68 pF 1.2 nF 1 µF