74LVT374, 74LVTH374 — Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
74LVT374, 74LVTH374 Rev. 1.5.0
January 2008
74LVT374, 74LVTH374
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Features
■
Input and output interface capability to systems at
5V V
CC
■
Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374)
■
Live insertion/extraction permitted
■
Power Up/Down high impedance provides glitch-free
bus loading
■
Outputs source/sink –32mA/+64mA
■
Functionally compatible with the 74 series 374
■
Latch-up performance exceeds 500mA
■
ESD performance:
– Human-body model
>
2000V
– Machine model
>
200V
– Charged-device model
>
1000V
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flops featuring separate D-type inputs
for each flip-flop and 3-STATE outputs for bus-oriented
applications. A buffered Clock (CP) and Output Enable
(OE
) are common to all flip-flops.
The LVTH374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal flip-flops are designed for low-voltage (3.3V)
V
CC
applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT374 and
LVTH374 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number Package Description
74LVT374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
