NXP Semiconductors
BTA330Y-800BT
3Q Hi-Com Triac
BTA330Y-800BT All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 27 July 2015 7 / 14
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6 - - 1.7 K/W
R
th(j-a)
thermal resistance
from junction to
ambient free air
in free air - 60 - K/W
10
-4
t
p
(s)
1 1010
-1
10
-3
10
-2
1
10
-1
10
Z
th(j-mb)
(K/W)
10
-2
aaa-019036
t
p
P
t
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
T
mb
= 25 °C
- - 2500 V
C
isol
isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; T
mb
= 25 °C
- 10 - pF