ISL59913IRZ-EVALZ

10
FN6406.0
December 15, 2006
Contrast
By varying the voltage between pins VGAIN and VREF, the
gain of the signal path can be changed in the ratio 4:1. The
gain change varies almost linearly with control voltage. For
normal operation it is anticipated the X2 mode will be selected
and the output load will be back matched. A unity gain to the
output load will then be achieved with a gain control voltage of
about 0.35V. This allows the gain to be trimmed up or down by
6dB to compensate for any gain/loss errors that affect the
contrast of the video signal. Figure 26 shows an example plot
of the gain to the load with gain control voltage.
C
ommon Mode Sync Decoding
The ISL59910 features common mode decoding to allow
horizontal and vertical synchronization information, which has
been encoded on the three differential inputs by the EL4543,
to be decoded. The entire RGB video signal can therefore be
transmitted, along with the associated synchronization
information, by using just three twisted pairs.
Decoding is based on the EL4543 encoding scheme, as
described in Figure 26 and Table 1. The scheme is a three-level
system, which has been designed such that the sum of the
common mode voltages results in a fixed average DC level with
no AC content. This eliminates the effect of EMI radiation into
the common mode signals along the twisted pairs of the cable
The common mode voltages are initially extracted by the
ISL59910 from the three input pairs. These are then passed to
an internal logic decoding block to provide Horizontal and
Vertical sync output signals (H
OUT
and V
OUT
).
Power Dissipation
The ISL59910 and ISL59913 are designed to operate with
±5V supply voltages. The supply currents are tested in
production and guaranteed to be less than 39mA per
channel. Operating at ±5V power supply, the total power
dissipation is:
where:
•PD
MAX
= Maximum power dissipation
•V
S
= Supply voltage = 5V
•I
MAX
= Maximum quiescent supply current per
channel = 39mA
•V
OUTMAX
= Maximum output voltage swing of the
application = 2V
R
L
= Load resistance = 150Ω Ω
θ
JA
required for long term reliable operation can be
calculated. This is done using Equation 3:
00.8
V
GAIN
0.4 1
2
1.8
1.4
1
0.6
0.4
GAIN (V)
0.60.2
1.6
1.2
0.8
FIGURE 25. VARIATION OF GAIN WITH GAIN CONTROL
VOLTAGE
TABLE 1. H AND V SYNC DECODING
RED CM GREEN CM BLUE CM H
SYNC
V
SYNC
Mid High Low Low Low
High Low Mid Low High
Low High Mid High Low
Mid Low High High High
NOTE: Level ‘Mid’ is halfway between ‘High’ and ‘Low’
TIME (0.5ms/DIV)
VOLTAGE
(0.5V/DIV)
BLUE CM
OUT (CH A)
GREEN CM
OUT (CH B)
RED CM
OUT (CH C)
V
SYNC
H
SYNC
VOLTAGE
(2.5V/DIV)
FIGURE 26. H AND V SYNCS ENCODED
PD
MAX
32V
S
× I
SMAX
V
S
( - V
OUTMAX
)
V
OUTMAX
R
L
----------------------------
×+××=
(EQ. 1)
PD
MAX
1.29W=
(EQ. 2)
ISL59910, ISL59913
11
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6406.0
December 15, 2006
Where
Tj is the maximum junction temperature (+150°C)
Ta is the maximum ambient temperature (+85°C)
For a QFN 28 package in a properly layout PCB heatsinking
copper area, +37°C/W θ
JA
thermal resistance can be
achieved. To disperse the heat, the bottom heatspreader
must be soldered to the PCB. Heat flows through the
heatspreader to the circuit board copper then spreads and
converts to air. Thus the PCB copper plane becomes the
heatsink. This has proven to be a very effective technique. A
separate application note details the 28 Ld QFN. PCB
design considerations are available.
θ
JA
Tj Ta()
PD
-----------------------
= 50.4CW=
(EQ. 3)
ISL59910, ISL59913
12
FN6406.0
December 15, 2006
ISL59910, ISL59913
QFN (Quad Flat No-Lead) Package Family
PIN #1
I.D. MARK
2
1
3
(N-2)
(N-1)
N
(N/2)
2X
0.075
TOP VIEW
(N/2)
NE
2
3
1
PIN #1 I.D.
(N-2)
(N-1)
N
b
L
N LEADS
BOTTOM VIEW
DETAIL X
PLANE
SEATING
N LEADS
C
SEE DETAIL "X"
A1
(L)
N LEADS
& EXPOSED PAD
0.10
SIDE VIEW
0.10 BA
M
C
C
B
A
E
2X
0.075 C
D
3
5
7
(E2)
(D2)
e
0.08 C
C
(c)
A
2
C
MDP0046
QFN (QUAD FLAT NO-LEAD) PACKAGE FAMILY
(COMPLIANT TO JEDEC MO-220)
SYMBOL QFN44 QFN38 QFN32 TOLERANCE NOTES
A 0.90 0.90 0.90 0.90 ±0.10 -
A1 0.02 0.02 0.02 0.02 +0.03/-0.02 -
b 0.25 0.25 0.23 0.22 ±0.02 -
c 0.20 0.20 0.20 0.20 Reference -
D 7.00 5.00 8.00 5.00 Basic -
D2 5.10 3.80 5.80 3.60/2.48 Reference 8
E 7.00 7.00 8.00 6.00 Basic -
E2 5.10 5.80 5.80 4.60/3.40 Reference 8
e 0.50 0.50 0.80 0.50 Basic -
L 0.55 0.40 0.53 0.50 ±0.05 -
N 44 38 32 32 Reference 4
ND 11 7 8 7 Reference 6
NE 11 12 8 9 Reference 5
SYMBOL QFN28 QFN24 QFN20 QFN16
TOLER-
ANCE NOTES
A 0.90 0.90 0.90 0.90 0.90 ±0.10 -
A1 0.02 0.02 0.02 0.02 0.02 +0.03/
-0.02
-
b 0.25 0.25 0.30 0.25 0.33 ±0.02 -
c 0.20 0.20 0.20 0.20 0.20 Reference -
D 4.00 4.00 5.00 4.00 4.00 Basic -
D2 2.65 2.80 3.70 2.70 2.40 Reference -
E 5.00 5.00 5.00 4.00 4.00 Basic -
E2 3.65 3.80 3.70 2.70 2.40 Reference -
e 0.50 0.50 0.65 0.50 0.65 Basic -
L 0.40 0.40 0.40 0.40 0.60 ±0.05 -
N 28 24 20 20 16 Reference 4
ND 6 5 5 5 4 Reference 6
NE 8 7 5 5 4 Reference 5
Rev 10 12/04
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package
(or Y-direction).
6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE.
7. Inward end of terminal may be square or circular in shape with radius
(b/2) as shown.
8. If two values are listed, multiple exposed pad options are available.
Refer to device-specific datasheet.

ISL59913IRZ-EVALZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Interface Development Tools ISL95210 5V/10AUCK FET INDSTRL TEMP RNG
Lifecycle:
New from this manufacturer.
Delivery:
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