NCP451
www.onsemi.com
12
PACKAGE DIMENSIONS
WLCSP6, 1.40x0.90
CASE 499BR
ISSUE A
SEATING
PLANE
0.25 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
−−−
MILLIMETERS
A1
D 1.40 BSC
E
b 0.21 0.25
e 0.50 BSC
0.50
D
E
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03
C
0.05 C
6X
b
ABC
1
2
0.10 C
A
A1
A2
C
0.17 0.23
0.90 BSC
0.25 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.25 REF
PITCH
0.25
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
0.50
RECOMMENDED
A1
PACKAGE
OUTLINE
PITCH
e/2
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NCP451/D
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