MAX1003EVKIT

Evaluate: MAX1002/MAX1003
External Clock Operation
The MAX1002/MAX1003 EV kits can be converted to
drive the ADCs from an external clock source. This
involves removing the external resonator components
from the VCO circuit and adding a few new compo-
nents. Table 4 lists the EV kit changes required to con-
vert the board to accept an external clock source. The
resulting schematic is shown in Figure 4.
The new 49.9value of R3 shown in Figure 4 provides
proper termination for a 50 external signal generator.
AC-coupling capacitor C6 couples the external clock
signal to the MAX1002/MAX1003 oscillator circuitry at
TNK+ (pin 9). R2 and C7 ensure that the impedance at
both ports of the oscillator is balanced. After all modifi-
cations are complete, connect an external clock source
to the BNC connector on the EV kit marked CLOCK
OVERDRIVE. The recommended clock amplitude is
1Vp-p; however, the ADC operates correctly with as lit-
tle as 100mVp-p or up to 2.5Vp-p on CLOCK OVER-
DRIVE.
The external clock source should have low phase noise
for best dynamic performance. A low-phase-noise
sine-wave oscillator serves this purpose well. A square-
wave clock source is not necessary to drive the
MAX1002/MAX1003. The devices contain sufficient
gain to amplify even a low-level-input sine wave to drive
the ADC comparators, while ensuring excellent dynam-
ic performance.
Digital Outputs
The TTL/CMOS-compatible digital outputs are present-
ed in parallel from both I and Q channels at connector
J1. The data format is offset binary with the MSB as D5
and the LSB as D0. The row of pins closest to the
board edge is digital output ground (OGND), while the
data bits occupy the inside row. Located in the middle
of the connector is the pin for the output clock labeled
DCLK. This signal can be used to latch the parallel out-
put data for capture into a logic analyzer or external
DSP circuitry. Both digital outputs are updated on
DCLK’s rising edge (see the timing diagram in the
MAX1002 or MAX1003 data sheet).
_____________Layout Considerations
The MAX1002/MAX1003 EV kit layouts have been opti-
mized for high-speed signals. Careful attention has
been given to grounding, power-supply bypassing, and
signal-path layout to minimize coupling between the
analog and digital sections of the circuit. For example,
the ground plane has been removed under the tank cir-
cuitry to reduce stray capacitive loading on the relative-
ly small capacitors required in the external resonant
tank formed by C5, L1, and D1. Other layout considera-
tions are detailed in the following sections.
Power Supplies and Grounding
The EV kits feature separate analog and digital power
supplies and grounds for best dynamic performance. A
thin trace located on the backside of the circuit board
near the VCC power-supply connector ties the analog
and output ground planes together. This trace can be
cut if the power-supply grounds are referenced else-
where.
Referencing analog and digital grounds together at a
single point usually avoids ground loops and corruption
of sensitive analog circuitry by noise from the digital
outputs. If the ground trace on the backside of the
board is cut, observe the absolute maximum ratings
between the two grounds.
MAX1002/MAX1003 Evaluation Kits
4 _______________________________________________________________________________________
5pF capacitor (MAX1003),
22pF capacitor (MAX1002)
Clock input BNC
connector
DESCRIPTION
47pF capacitors
COMPONENT
Clock Overdrive
C6, C7
C5
Remove
Add
MODIFICATION
Replace with
0.01µF capaci-
tors
10kresistor
220nH inductor
Remove
Remove
47kresistors
Replace with
49.9resistors
L1
R2, R3
R1
Varactor diode RemoveD1
Table 4. External Clock Source EV Kit
Modifications
Bypassing
Proper bypassing is essential to achieve the best
dynamic performance from the converters. The
MAX1002/MAX1003 EV kits use 10µF bypass capaci-
tors located close to the power-supply connectors on
the board to filter low-frequency supply ripple. High-fre-
quency bypassing is accomplished with ceramic chip
capacitors located very close to the device’s supply
pins.
As the digital outputs toggle, transient currents in the
V
CCO
supply can couple into sensitive analog circuitry
and severely degrade the converters’ effective number
of bits performance. Of particular concern is effectively
bypassing V
CCO
to OGND. For best results, locate the
bypass capacitors on the same side of the board and
place them close to the device. This avoids the use of
through-holes and results in lower series inductance.
The capacitor size chosen for the EV kits (size 0603)
keeps the layout compact. Finally, the modest value
(47pF) and small size result in a high self-resonant fre-
quency for effective high-frequency bypassing.
__________Applications Information
To achieve the full dynamic potential from the convert-
ers, minimize the capacitive loading on the digital out-
puts to reduce the transient currents at V
CCO
and
OGND. The maximum capacitance per output bit
should be less than 15pF. For example, the capaci-
tance of the digital output traces and the J1 connector
on the EV kits is about 3pF per trace. In an applications
circuit, this could be further reduced by locating the
digital receiving chip very close to the MAX1002/
MAX1003 and removing the ground plane from under
the output bit traces.
A logic analyzer can be connected to the J1 connector
on the EV kits for evaluation purposes. The analyzer
should be directly connected to the EV kit without any
additional ribbon cables. Even a short length of ribbon
cable can exceed the maximum recommended capaci-
tive loading of the digital outputs. A typical high-speed
logic analyzer probe adds about another 8pF loading
per digital bit, which is acceptable for good dynamic
performance.
Evaluate: MAX1002/MAX1003
MAX1002/MAX1003 Evaluation Kits
_______________________________________________________________________________________ 5
Evaluate: MAX1002/MAX1003
MAX1002/MAX1003 Evaluation Kits
6 _______________________________________________________________________________________
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
1 3
JU5
2
2
3
4
5
6
7
8
9
10
11
12
13
14
MAX1003
(MAX1002)
22
21
20
19
15
QIN-
V
CC
GND
GND
TNK-
TNK+
V
CC
GND
V
CC
IIN-
IIN+
IOCC-
IOCC+
GAIN
IIN+
QIN-
QIN+
BNC
BNC
R4
49.9
R5
49.9
R3
47k
C10
0.01µF
C4
0.22µF
R1
10k
D1
R2
47k
R7
49.9
R6
49.9
VTUNE
VCC
BNC
(22pF)
BNC
= ANALOG GROUND (GND)
= DIGITAL GROUND (OGND)
1
2
3
C8
0.1µF
C9
0.1µF
JU4
VCC
JU3
JU6
0
C13
0.1µF
C1
0.01µF
C3
47pF
C2
47pF
C11
0.01µF
C12
0.01µF
C14
0.1µF
C6
47pF
C7
47pF
C5
5pF
L1
220nH
VCC
JU7
0
IIN-
GND
QOCC+
QOCC-
QIN+
V
CC
DI5
DI4
DI3
DI2
DI1
DQ2
DI0
DCLK
V
CC
OGND
V
CC
DQ0
DQ1
GND
DQ3
DQ4
DQ5
J1–1
J1–3
J1–5
J1–7
J1–9
J1–11
J1–13
JU2
0
JU1
0
VCC
VCCO
J1–15
J1–17
J1–19
J1–21
J1–23
J1–25
J1–4
J1–6
J1–8
J1–10
J1–12
J1–2
J1–16
J1–18
J1–20
J1–22
J1–24
J1–26
J1–14
U1
16
17
18
VTUNE VTUNE
= MAX1002
C16
10µF
VCC
VCCO
JU11
CUT HERE
TO SEPARATE
GROUNDS
JU9
JU8
VCC
GND
VCCO
C15
0.22µF
C17
10µF
OGND
( )
Figure 3. MAX1002/MAX1003 EV Kit Schematic (Voltage-Controlled-Oscillator Mode)

MAX1003EVKIT

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Data Conversion IC Development Tools Eval Kit MAX1002, MAX1003 (Low-Power, 60Msps, Dual, 6-Bit ADC)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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