PR3BMF11NSZF Datasheet PR3BMF11NSZ, PR3BMF11NSZF | P4-P6

■ Electro-optical Characteristics

Parameter Symbol Unit

Input

Output

(T

a

=25˚C)

Forward voltage

Reverse current

Repetitive peak OFF-state current

ON-state voltage

Holding current

Critical rate of rise of OFF-state voltage

Minimum trigger current

Isolation resistance

Turn-on time

V

F

I

R

I

DRM

V

T

I

H

dV/dt

I

FT

R

ISO

t

on

V

µA

V

mA

V/µs

mA

Ω

µs

I

F

=20mA

V

R

=3V

V

D

=V

DRM

I

T

=1.2A

V

D

=6V

V

D

=1/√

−

2 ·V

DRM

V

D

=6V, R

L

=100Ω

DC500V,40 to 60%RH

V

D

=

6V, R

L

=

100Ω, I

F

=

20mA

Conditions

−

100

−

5

×

10

−

1.2

−

10

11

−

1.4

10

100

3.0

25

−

10

−

100

MIN. TYP. MAX.

Transfer

charac-

teristics

■ Absolute Maximum Ratings

4

Parameter Symbol Rating Unit

Input

Output

(T

a

=25˚C)

Forward current

Reverse voltage

RMS ON-state current

Peak one cycle surge current

Repetitive peak OFF-state voltage

Isolation voltage

Operating temperature

Storage temperature

Soldering temperature

*2

*1

I

F

V

R

I

T

(rms)

I

surge

V

DRM

V

iso

(rms)

T

opr

T

stg

T

sol

mA

V

A

V

kV

˚C

*4

*5

*3

50

6

1.2

12

600

4.0

−30 to +105

−40 to +125

270

*1 40 to 60%RH, AC for 1minute, f=60Hz

*2 For 10s

*3 Refer to Fig.1, Fig.2

*4 f=50Hz sine wave

*5 Lead solder plating models : 260˚C

PR3BMF11NSZ Series

1mm

Soldering area

Sheet No.: D4-A00901EN

5

Please contact a local SHARP sales representative to see the actual status of the production.

PR3BMF11NSZ Series

Sheet No.: D4-A00901EN

■ Model Line-up (1) (Lead-free terminal components)

■ Model Line-up (2) (Lead solder plating components)

Through-Hole

MAX.10

Sleeve

50pcs/sleeve

Approved Approved

Taping

1 000pcs/reel

SMT Gullwing

PR3BMF11NSZF PR3BMF11NIPFPR3BMF11YSZF PR3BMF11YIPF

600

I

FT

[mA]

(V

D

=6V,

R

L

=100Ω)

1

Rank mark

Lead Form

Shipping Package

DIN

EN60747-5-2

Model No.

V

DRM

[V]

--

Through-Hole

MAX.10

Sleeve

50pcs/sleeve

Approved Approved

Taping

1 000pcs/reel

SMT Gullwing

PR3BMF11NSZ

-

PR3BMF11YSZ

-

600

I

FT

[mA]

(V

D

=6V,

R

L

=100Ω)

1

Rank mark

Lead Form

Shipping Package

DIN

EN60747-5-2

Model No.

V

DRM

[V]

--

6

PR3BMF11NSZ Series

Forward current I

F

(mA)

Ambient temperature T

a

(˚C)

0

10

20

40

50

30

60

−30 0 50 100

Fig.1 Forward Current vs. Ambient

Temperature

Fig.2 RMS ON-state Current vs.

Ambient Temperature

Sheet No.: D4-A00901EN

0

0.2

0.4

1.2

0.8

1.0

0.6

1.4

−30 0 50 100

RMS ON-state current I

T

(rms) (A)

Ambient temperature T

a

(˚C)

CONDITION

∗No heat sink

∗Paper phenol boad:

100mm×100mm×1.6mm

∗All pins should be installed in

the print board with soldering

∗Solder land:140mm

2

(the total of all solder land area)

50

5

1

100

10

0.5011.5 2 2.5 3

−25˚C

50˚C

25˚C

0˚C

Forward current I

F

(mA)

Forward voltage V

F

(V)

T

a

=75˚C

Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.

Ambient Temperature

0

2

4

6

8

12

10

−30 0 50 100

Minimum trigger current I

FT

(mA)

Ambient temperature T

a

(˚C)

V

D

=6V

R

L

=100Ω

Fig.5 ON-state Voltage vs.

Ambient Temperature

Fig.6 Relative Holding Current vs.

Ambient Temperature

0.8

1

0.9

1.2

1.1

1.3

1.4

ON-state voltage V

T

(V)

Ambient temperature T

a

(˚C)

I

T

=1.2A

−30 0 50 100

10

100

1 000

Relative holding current I

H

(t˚C) / I

H

(25˚C)×100%

Ambient temperature T

a

(˚C)

V

D

=6V

−30 0 50 100

PR3BMF11NSZF

PR3BMF11NSZF

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