DS8113
Smart Card Interface
16 ______________________________________________________________________________________
Applications Information
Performance can be affected by the layout of the appli-
cation. For example, an additional cross-capacitance of
1pF between card reader contacts C2 (RST) and C3
(CLK) or C2 (RST) and C7 (I/O) can cause contact C2
to be polluted with high-frequency noise from C3 (or
C7). In this case, include a 100pF capacitor between
contacts C2 and CGND.
Application recommendations include the following:
Ensure there is ample ground area around the
DS8113 and the connector; place the DS8113
very near to the connector; decouple the VDD and
VDDA lines separately. These lines are best posi-
tioned under the connector, connected in a star on
the main trace.
The DS8113 and the host microcontroller must use
the same VDD supply. Pins CLKDIV1, CLKDIV2,
RSTIN, PRES, AUX1IN, I/OIN, AUX2IN, 5V/3V,
1_8V, CMDVCC, and OFF are referenced to VDD;
if pin XTAL1 is to be driven by an external clock,
also reference this pin to VDD.
Trace C3 (CLK) should be placed as far as possi-
ble from the other traces.
The trace connecting CGND to C5 (GND) should
be straight (the two capacitors on C1 (VCC)
should be connected to this ground trace).
Avoid ground loops among CGND, PGND, and
GND.
With all these layout precautions, noise should be kept
to an acceptable level and jitter on C3 (CLK) should be
less than 100ps. Reference layouts, designs, and an
evaluation kit are available on request.
Selector Guide
Note: Contact the factory for availability of other variants and
package options.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
PART
LOW STOP-
MODE POWER
LOW ACTIVE-
MODE POWER
PIN-
PACKAGE
DS8113-RNG+ Yes Yes 28 SO
DS8113-JNG+ Yes Yes 28 TSSOP
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
28 SO (300 mils) W28+6
21-0042
28 TSSOP U28+2
21-0066
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
DS8113
Smart Card Interface
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
17
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
EMVCo approval of the interface module (IFM) contained in this Terminal shall mean only that the IFM has been tested in accordance and for sufficient
conformance with the EMV Specifications, Version 3.1.1, as of the date of testing. EMVCo approval is not in any way an endorsement or warranty regarding
the completeness of the approval process or the functionality, quality or performance of any particular product or service. EMVCo does not warrant any
products or services provided by third parties, including, but not limited to, the producer or provider of the IFM and EMVCo approval does not under any
circumstances include or imply any product warranties from EMVCo, including, without limitation, any implied warranties of merchantability, fitness for pur-
pose, or noninfringement, all of which are expressly disclaimed by EMVCo. All rights and remedies regarding products and services which have received
EMVCo approval shall be provided by the party providing such products or services, and not by EMVCo and EMVCo accepts no liability whatsoever in
connection therewith.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0 1/08 Initial release
In the Recommended DC Operating Conditions table, changed I/OIN, AUX1IN/AUX2IN
specs to reference V
DD
rather than V
CC
and corrected I
OH
to μA.
5
1 2/08
In the Pin Description, removed references to active low from the PRES description. 7
2 5/08
In the Recommended DC Operating Conditions table, clarified specifications of V
TH2
,
f
INT
, V
CCSR
, and I
IL_IO
.
2–5
3 4/10
Added the TSSOP package (see the Ordering Information, Pin Configuration, Selector
Guide, and Package Information sections); added the lead temperature and updated
the soldering temperature in the Absolute Maximum Ratings.
1, 2, 16

DS8113-RNG+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Interface - Specialized Smart Card Interface
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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