16
AT25128A/256A
3368B–SEEPR–1/04
8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
10/7/03
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
A 1.35 1.75
b 0.31 0.51
C 0.17 0.25
D 4.80 5.00
E1 3.81 3.99
E 5.79 6.20
e 1.27 BSC
L 0.40 1.27
Top View
End View
Side View
e
B
D
A
A1
N
E
1
C
E1
L
17
AT25128A/256A
3368B–SEEPR–1/04
8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
10/7/03
8S2
C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs are not included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/0.005 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 5
C 0.15 0.35 5
D 5.13 5.35
E1 5.18 5.40 2, 3
E 7.70 8.26
L 0.51 0.85
e 1.27 BSC 4
End View
Side View
e
b
A
A1
D
E
N
1
C
E1
L
Top View
18
AT25128A/256A
3368B–SEEPR–1/04
8CN3 – LAP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN3, 8-lead, (6 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN3
11/14/01
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 1
D 5.89 5.99 6.09
E 4.83 4.93 5.03
e 1.27 BSC
e1 0.56 REF
L 0.62 0.67 0.72 1
L1 0.92 0.97 1.02 1
Note: 1. Metal Pad Dimensions.

AT25256A-10CI-2.7

Mfr. #:
Manufacturer:
Description:
IC EEPROM 256K SPI 20MHZ 8LAP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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