LT1206
13
1206fb
applicaTions inForMaTion
Precision ×10 Hi Current Amplifier CMOS Logic to Shutdown Interface
Low Noise ×10 Buffered Line Driver Distribution Amplifier
Buffer A
V
= 1
+
LT1097
+
LT1206
V
IN
S/D
COMP
0.01µF
3k330Ω
10k
1k
OUT
OUTPUT OFFSET: < 500µV
SLEW RATE: 2V/µs
BANDWIDTH: 4MHz
STABLE WITH C
L
< 10nF
1206 TA02
500pF
+
LT1206
S/D
–15V
15V
24k
10k
5V
2N3904
1206 TA03
+
LT1115
1µF
15V
1µF
15V
68pF
1µF
15V
1µF
+
LT1206
0.01µF
15V
560Ω560Ω
909Ω
100Ω
R
L
OUTPUT
R
L
= 32Ω
V
O
= 5V
RMS
THD + NOISE = 0.0009% AT 1kHz
= 0.004% AT 20kHz
SMALL SIGNAL 0.1dB BANDWIDTH = 600kHz
1206 TA04
S/D
+
+
+
+
+
LT1206
S/D
75Ω
V
IN
R
F
R
G
75Ω
75Ω
75Ω
75Ω
75Ω CABLE
1206 TA05
+
LT1206
S/D
0.01µF*
V
OUT
R
F
**
V
IN
1206 TA06
OPTIONAL, USE WITH CAPACITIVE LOADS
VALUE OF R
F
DEPENDS ON SUPPLY
VOLTAGE AND LOADING. SELECT
FROM TYPICAL AC PERFORMANCE
TABLE OR DETERMINE EMPIRICALLY
*
**
COMP
LT1206
14
1206fb
package DescripTion
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ± .005
(3.302 ± 0.127)
.020
(0.508)
MIN
.018 ± .003
(0.457 ± 0.076)
.120
(3.048)
MIN
12
3
4
87 6
5
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
LT1206
15
1206fb
package DescripTion
R Package
7-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1462 Rev E)
R (DD7) 0710 REV E
.026 – .035
(0.660 – 0.889)
TYP
.143
+.012
–.020
( )
3.632
+0.305
–0.508
.050
(1.27)
BSC
.013 – .023
(0.330 – 0.584)
.095 – .115
(2.413 – 2.921)
.004
+.008
–.004
( )
0.102
+0.203
–0.102
.050 ± .012
(1.270 ± 0.305)
.059
(1.499)
TYP
.045 – .055
(1.143 – 1.397)
.165 – .180
(4.191 – 4.572)
.330 – .370
(8.382 – 9.398)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
15° TYP
.420
.350
.585
.090
.035
.050
.325
.205
.080
.585
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
RECOMMENDED SOLDER PAD LAYOUT
.090
.035.050
.420
.276
.320
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.300
(7.620)
.075
(1.905)
.183
(4.648)
.060
(1.524)
.060
(1.524)
.256
(6.502)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
R Package
7-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1462 Rev E)

LT1206CR#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
High Speed Operational Amplifiers 250mA Out, 900V/us, 60MHz CFA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union