AS7C3256A-12JCNTR

April 2004
Copyright © Alliance Semiconductor. All rights reserved.
AS7C3256A
4/23/04; v.2.0 Alliance Semiconductor P. 1 of 9
3.3V 32K X 8 CMOS SRAM (Common I/O)
®
Features
Pin compatible with AS7C3256
Industrial and commercial temperature options
Organization: 32,768 words × 8 bits
High speed
- 10/12/15/20 ns address access time
- 5, 6, 7, 8 ns output enable access time
Very low power consumption: ACTIVE
- 180mW max @ 10 ns
Very low power consumption: STANDBY
- 7.2 mW max CMOS I/O
Easy memory expansion with
CE
and
OE
inputs
TTL-compatible, three-state I/O
28-pin JEDEC standard packages
- 300 mil SOJ
-8 × 13.4 mm TSOP 1
ESD protection 2000 volts
Latch-up current 200 mA
Logic block diagram
A
9
A
8
256 X 128 X 8
Array
(262,144)
Input buffer
A0
A1
A2
A3
A4
A5
A6
A7
A
10
A
11
A
12
A
13
A
14
I/O0
I/O7
V
CC
GND
OE
CE
WE
Column decoder
Row decoder
Control
circuit
Sense amp
Pin arrangement
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A14
A12
A7
A6
A5
A4
A3 A2
A1
A0
I/O0
I/O1
I/O2
GND
AS7C3256A
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
AS7C3256A
16
15
28-pin TSOP 1 (8×13.4 mm)
28-pin SOJ (300 mil)
Selection guide
-10 -12 -15 -20 Unit
Maximum address access time 10 12 15 20 ns
Maximum output enable access time 5 6 7 8 ns
Maximum operating current 50 45 40 35 mA
Maximum CMOS standby current 2 2 2 2 mA
®
AS7C3256A
4/23/04; v.2.0 Alliance Semiconductor P. 2 of 9
Functional description
The AS7C3256A is a 3.3V high-performance CMOS 262,144-bit Static Random-Access Memory (SRAM) device
organized as 32,768 words × 8 bits. It is designed for memory applications requiring fast data access at low voltage,
including Pentium
TM
, PowerPC
TM
, and portable computing. Alliance’s advanced circuit design and process techniques
permit 3.3V operation without sacrificing performance or operating margins.
The device enters standby mode when
CE
is high. CMOS standby mode consumes 7.2 mW. Normal operation offers 75%
power reduction after initial access, resulting in significant power savings during CPU idle, suspend, and stretch mode.
Equal address access and cycle times (t
AA
, t
RC
, t
WC
) of 10/12/15/20 ns with output enable access times (t
OE
) of 5, 6, 7, 8 ns
are ideal for high-performance applications. The chip enable (
CE
) input permits easy memory expansion with multiple-bank
memory organizations.
A write cycle is accomplished by asserting chip enable (
CE
) and write enable (
WE
) LOW. Data on the input pins I/O0-I/O7
is written on the rising edge of
WE
(write cycle 1) or
CE
(write cycle 2). To avoid bus contention, external devices should
drive I/O pins only after outputs have been disabled with output enable (
OE
) or write enable (
WE
).
A read cycle is accomplished by asserting chip enable (
CE
) and output enable (
OE
) LOW, with write enable (
WE
) high. The
chip drives I/O pins with the data word referenced by the input address. When chip enable or output enable is high, or write
enable is low, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible. Operation is from a single 3.3 ±0.3V supply. The AS7C3256A is packaged
in high volume industry standard packages.
Absolute maximum ratings
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Truth table
Key: X = Don’t care, L = Low, H = High
Parameter Symbol Min Max Unit
Voltage on V
CC
relative to GND V
t1
–0.5 +5.0 V
Voltage on any pin relative to GND V
t2
–0.5 V
CC
+ 0.5 V
Power dissipation P
D
–1.0W
Storage temperature (plastic) T
stg
–65 +150
o
C
Ambient temperature with V
CC
applied T
bias
–55 +125
o
C
DC current into outputs (low) I
OUT
–20mA
CE WE OE
Data Mode
H X X High Z Standby (I
SB
, I
SB1
)
L H H High Z Output disable (I
CC
)
LHLD
OUT
Read (I
CC
)
LLXD
IN
Write (I
CC
)
AS7C3256A
4/23/04; v.2.0 Alliance Semiconductor P. 3 of 9
®
Recommended operating conditions
*
V
IL
min = –1.0V for pulse width less than 5ns.
**
V
IH
max = V
CC
+ 2.0V for pulse width less than 5ns.
DC operating characteristics (over the operating range)
1
Capacitance (f = 1MHz, T
a
= room temperature, V
CC
= NOMINAL)
2
Parameter Symbol Min Typical Max Unit
Supply voltage V
CC
3.0 3.3 3.6 V
Input voltage
V
IH
**
2.0 V
CC
+0.5 V
V
IL
*
-0.5 0.8 V
Ambient operating temperature
commercial T
A
0–70
o
C
industrial T
A
–40 85
o
C
Parameter Sym Test conditions
-10 -12 -15 -20
UnitMin Max Min Max Min Max Min Max
Input leakage
current
|I
LI
|
V
CC
= Max,
V
in
= GND to V
CC
–1–1–1–1µA
Output leakage
current
|I
LO
|
V
CC
= Max,
V
OUT
= GND to V
CC
–1–1–1–1µA
Operating
power supply
current
I
CC
V
CC
= Max, CE V
IL
f = f
Max
, I
OUT
= 0mA
–50–45–40–35mA
Standby power
supply current
I
SB
V
CC
= Max, CE > V
IH
f = f
Max
–20–20–20–20mA
I
SB1
V
CC
= Max, CE > V
CC
–0.2V
V
IN
< 0.2V or
V
IN
> V
CC
–0.2V, f = 0
–2.0–2.0–2.0–2.0mA
Output voltage
V
OL
I
OL
= 8 mA, V
CC
= Min –0.4–0.4–0.4–0.4V
V
OH
I
OH
= –4 mA, V
CC
= Min 2.4–2.4–2.4–2.4– V
Parameter Symbol Signals Test conditions Max Unit
Input capacitance C
IN
A,
CE
,
WE
,
OE
V
in
= 0V 5 pF
I/O capacitance C
I/O
I/O V
in
= V
out
= 0V 7 pF

AS7C3256A-12JCNTR

Mfr. #:
Manufacturer:
Alliance Memory
Description:
SRAM 256K 3.3V 12ns FAST 32K x 8 Asynch SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union