TLP109(IGM)
2014-09-01
6
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 °C for 60 to 120 seconds.
Mounting condition of 260 °C or less within 10 seconds is recommended.
Flow soldering must be performed once.
3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds
not exceeding 350 °C.
Heating by soldering iron must be only once per lead.