MBRAF360T3G, NRVBAF360T3G
www.onsemi.com
5
PACKAGE DIMENSIONS
SMA−FL
CASE 403AA
ISSUE O
D
E
b
L
c
SOLDER FOOTPRINT*
DIMENSIONS: MILLIMETERS
5.56
1.76
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1.30
RECOMMENDED
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM MIN MAX
MILLIMETERS
A 0.90 1.10
b 1.25 1.65
c 0.15 0.30
D 2.40 2.80
TOP VIEW
E1
BOTTOM VIEW
2X
2X
SIDE VIEW
A
C
SEATING
PLANE
E 4.80 5.40
E1 4.00 4.60
L 0.70 1.10
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