I2124 rev. B 10/99
8EWF..S QUIET
IR
Series
T
J
Max. Junction Temperature Range - 4 0 to 150 °C
T
stg
Max. Storage Temperature Range - 40 to 150 °C
Soldering Temperature 240 °C for 10 seconds
R
thJC
Max. Thermal Resistance Junction 2.5 °C/W DC operation
to Case
R
thJA
Typ. Thermal Resistance Junction 50 °C/W
to Ambient (PCB Mount)**
wt Approximate Weight 1(0.03) g (oz.)
Case Style TO-252AA (D-Pak)
Thermal-Mechanical Specifications
Parameters 8EWF..S Units Conditions
**When mounted on 1" square (650mm
2
) PCB of FR-4 or G-10 material 4 oz (140µm) copper 40°C/W
For recommended footprint and soldering techniques refer to application note #AN-994
Fig. 1 - Current Rating Characteristics
Fig. 3 - Forward Power Loss Characteristics
Fig. 4 - Forward Power Loss Characteristics
Fig. 2 - Current Rating Characteristics
60
70
80
90
100
110
120
130
140
150
0123456789
30°
60°
90°
120°
180°
Maximum Allowable Case Temperature (°C)
Conduction Angle
Average Forward Current (A)
8EWF..S Series
R (DC) = 2.5 °C/W
thJC
70
80
90
100
110
120
130
140
150
02468101214
DC
30°
60°
90°
120°
180°
Maximum Allowable Case Temperature (°C)
Conduction Period
Average Forward Current (A)
8EWF..S Series
R (DC) = 2.5 °C/W
thJC
0
2
4
6
8
10
12
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RMS Limit
180°
120°
90°
60°
30°
Conduction Angle
Average Forward Current (A)
Maximum Average Forward Power Loss (W)
8EWF..S Series
T = 150°C
J
0
2
4
6
8
10
12
14
16
02468101214
DC
180°
120°
90°
60°
30°
RMS Limit
Conduction Period
Average Forward Current (A)
Maximum Average Forward Power Loss (W)
8EWF..S Series
T = 150°C
J
