CBT3384_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 2 November 2009 9 of 14
NXP Semiconductors
CBT3384
10-bit bus switch with 5-bit output enables
Fig 9. Package outline SOT340-1 (SSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65 1.25
7.9
7.6
0.9
0.7
0.8
0.4
8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
A
max.
2
CBT3384_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 2 November 2009 10 of 14
NXP Semiconductors
CBT3384
10-bit bus switch with 5-bit output enables
Fig 10. Package outline SOT556-1 (SSOP24)
UNIT A
1
A
2
A
3
H
E
L
p
b
p
cD
(1)
E
(1)
Z
(1)
eL ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635 1
6.2
5.8
0.89
0.41
1.05
0.66
8
0
o
o
8
0
o
o
0.180.25 0.1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
SOT556-1
99-12-27
03-02-18
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
1
12
24
13
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
MO-137
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
A
max.
1.73
inches
0.0098
0.0040
0.061
0.055
0.01
0.012
0.008
0.0098
0.0075
0.344
0.337
0.157
0.150
0.025 0.041
0.244
0.228
0.035
0.016
0.040
0.026
0.0070.01 0.004
0.068
CBT3384_6 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 06 — 2 November 2009 11 of 14
NXP Semiconductors
CBT3384
10-bit bus switch with 5-bit output enables
Fig 11. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1

CBT3384D,118

Mfr. #:
Manufacturer:
Nexperia
Description:
Digital Bus Switch ICs 10-BIT BUS SW W5-BIT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union