© Semiconductor Components Industries, LLC, 2012
April, 2017 − Rev. 6
1 Publication Order Number:
MBRA210LT3/D
MBRA210L, NRVBA210L
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes. Typical applications are
AC−DC and DC−DC converters, reverse battery protection, and
“Oring” of multiple supply voltages and any other application where
performance and size are critical.
Features
• Ultra Low V
F
• 1st in the Market Place with a 10 V
R
Schottky Rectifier
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Optimized for Low Forward Voltage
• NRVBA Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Ratings:
♦ Machine Model = C
♦ Human Body Model = 3A
SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
10 VOLTS
www.onsemi.com
Device Package Shipping
†
ORDERING INFORMATION
MBRA210LT3G SMA
(Pb−Free)
5,000 / Tape
& Reel
MARKING DIAGRAM
SMA
CASE 403D
B2L1
AYWW
G
B2L1 = Specific Device Code
A = Assembly Location**
Y = Year
WW = Work Week
G = Pb−Free Package
NRVBA210LT3G* SMA
(Pb−Free)
5,000 / Tape
& Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
**The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter pin),
the front side assembly code may be blank.
(Note: Microdot may be in either location)