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BLM18HG601SN1D

P1-P3P4-P6P7-P8
Spec. No. JENF243A-0004P-01 P1/8
MURATA MFG.CO., LTD.
Reference
Only
GHz Noise Suppression Chip Ferrite Bead
BLM18H□□□□SN1□ Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18H_SN Series.
2. Part Numbering
(ex.) BL
M 18 HG 601 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(Under Standard Testing Condition)
(Note)
Rated Current
(mA)
DC Resistance
( max. )
Remark
at 100MHz
at 1GHz
at
85℃
at
125℃
Initial
Values
Values
After
Testing
Typical
BLM18HE601SN1D
600±25% 300 min. 600
*1
800
*1
600
0.25 0.30
For
Large
Current
BLM18HE601SN1B
BLM18HE102SN1D
1000±25% 500 min. 1000
*1
600
*1
500
0.35 0.40
BLM18HE102SN1B
BLM18HE152SN1D
1500±25% 750 min. 1500
*1
500
*1
400
0.50 0.55
BLM18HE152SN1B
BLM18HG471SN1D
470±25% 400 min. 600 200 0.85 0.95
For
general
use
BLM18HG471SN1B
BLM18HG601SN1D
600±25% 450 min. 700 200 1.0 1.1
BLM18HG601SN1B
BLM18HG102SN1D
1000±25% 750 min. 1000 100 1.6 1.7
BLM18HG102SN1B
BLM18HD471SN1D
470±25% 700 min. 1000 100 1.2 1.3
For
high speed
signal line
BLM18HD471SN1B
BLM18HD601SN1D
600±25% 850 min. 1200 100 1.5 1.6
BLM18HD601SN1B
BLM18HD102SN1D
1000±25% 1100 min. 1700 50 1.8 1.9
BLM18HD102SN1B
BLM18HB121SN1D
120±25% 500±40% 200 0.5 0.6
BLM18HB121SN1B
BLM18HB221SN1D
220±25% 1100±40% 100 0.8 0.9
BLM18HB221SN1B
BLM18HB331SN1D
330±25% 1600±40% 50 1.2 1.3
BLM18HB331SN1B
BLM18HK331SN1D
330±25% 400±40% 200 0.5 0.6
For
Digital
Interface
BLM18HK331SN1B
BLM18HK471SN1D
470±25% 600±40% 200 0.7 0.8
BLM18HK471SN1B
BLM18HK601SN1D
600±25% 700±40% 100 0.9 1.0
BLM18HK601SN1B
BLM18HK102SN1D
1000±25% 1200±40% 50 1.5 1.6
BLM18HK102SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
Spec. No. JENF243A–0004N-01 P 2/ 8
MURATA MFG CO., LTD.
Reference
Only
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
■ Equivalent Circuit
■ Unit Mass (Typical value)
(in mm) 0.005g
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : Agilent 4291A or the equivalent
Test Fixture : Agilent 16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 6.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
:Electrode
1.6±0.15
0.8±0.15
0.4±0.2
0.8±0.15
Resistance element becomes
dominant at high frequencies.
()
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance
Meet item 3.
R0.5
Ｆ
Substrate
Ｆ
Side view
Spec. No. JENF243A–0004N-01 P 3/ 8
MURATA MFG CO., LTD.
Reference
Only
No. Item Specification Test Method
7-2 ｰ
3
Bending
Strength
Meet Table 1. It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.0mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2 ｰ
4
Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s∼90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for
48h±4h.
7-2 ｰ
6
Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction
(Total 9 times)
7-2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s∼90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 1. 1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 10min to 15min
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
45mm
R340
F
Deflection
45mm
Product
Pressure jig
P1-P3P4-P6P7-P8

BLM18HG601SN1D

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EMI Filter Beads, Chips & Arrays 0603 600 OHM
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