LTC5532
13
5532f
APPLICATIO S I FOR ATIO
WUUU
Figure 2. Mobile Phone Tx Power Control Application Diagram with a Capacitive Tap
Applications
The LTC5532 can be used as a self-standing signal strength
measuring receiver for a wide range of input signals from
–32dBm to 10dBm for frequencies from 300MHz to 7GHz.
Operation at higher frequencies, to 12GHz or above, is
achievable with reduced performance. The smaller DFN
package version is recommended for these applications
because of its lower parasitics. Figure 1 plots the output
voltage as a function of RF power of a 12GHz CW input
signal.
The LTC5532 can be used as a demodulator for AM and
ASK modulated signals with data rates up to 2MHz.
Depending on specific application needs, the RSSI output
can be split between two branches, providing AC-coupled
data (or audio) output and DC-coupled RSSI output for
signal strength measurements and AGC.
The LTC5532 can be used for RF power detection and
control. Figure 2 is an example of a transmitter power
controller, using the LTC5532 with a capacitive tap to the
power amplifier. A 0.5pF capacitor (C1) followed by a
200 resistor (R1) form a coupling circuit with about
20dB loss at 900MHz referenced to the LTC5532 RF input
pin. In the actual product implementation, component
values for the capacitive tap may be different depending on
parts placement, PCB parasitics and parameters of the
antenna.
The LTC5532 can be configured as a comparator for RF
power detection and RF power alarms. The characteriza-
tion data includes a plot of the LTC5532 output delay in
response to a positive input step of varying RF level.
RF
IN
GND
V
OS
V
CC
V
OUT
V
M
LTC5532ES6
1
2
3
6
5
4
0.1µF
R2
R3
5532 F02
Li-Ion
CELL BAND
PCS BAND
VPC
MOBILE
PHONE
DSP
OFFSET
ADJUSTMENT
DIPLEXER
TX PA
MODULE
R1
200
1%
C1
0.5pF
±0.05pF
BSE
RF INPUT POWER (dBm)
–32
0
V
OUT
OUTPUT VOLTAGE (mV)
400
1200
1600
2000
–8 –4 0 4
3600
5532 F01
800
–28 –24 –20 –16 –12 8
2400
2800
3200
T
A
= 25°C
Figure 1. Typical Detector Characteristics,
12GHz, Gain = 2, V
OS
= 0V (DFN Package)
LTC5532
14
5532f
PACKAGE DESCRIPTIO
U
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.56 ± 0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
1.37 ±0.05
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
0.25 ± 0.05
1.42 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
1.15 ±0.05
0.675 ±0.05
2.50 ±0.05
PACKAGE
OUTLINE
0.50 BSC
PIN 1
CHAMFER OF
EXPOSED PAD
LTC5532
15
5532f
PACKAGE DESCRIPTIO
U
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

LTC5532ES6#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Detector Prec 300MHz to 7GHz RF Detector w/ Gain
Lifecycle:
New from this manufacturer.
Delivery:
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