MC100EP91MNG

MC100EP91
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7
Application Information
All MC100EP91 inputs can accept LVPECL, LVTTL,
LVCMOS, HSTL, CML, or LVDS signal levels. The
limitations for differential input signal (LVDS, HSTL,
LVPECL, or CML) are the minimum input swing of 150 mV
and the maximum input swing of 3.0 V. Within these
conditions, the input voltage can range from V
CC
to GND.
Examples interfaces are illustrated below in a 50 W
environment (Z = 50 W).
V
EE
GND GND V
EE
Z
Z
V
CC
V
CC
GND
LVPECL
Driver
EP91
50 W
V
TT
= V
CC
2.0 V
50 W
D
D
V
CC
V
CC
LVDS
Driver
EP91
Z
Z
D
D
100 W
Figure 6. Standard LVPECL Interface
Z
Z
V
CC
V
CC
HSTL
Driver
EP91
50 W 50 W
D
D
GND
Z
Z
V
CC
V
CC
CML
Driver
EP91
50 W
V
CC
50 W
D
D
Figure 7. Standard LVDS Interface
Figure 8. Standard HSTL Interface
Figure 9. Standard 50 W Load CML Interface
GND V
EE
GND GND V
EE
GND GND
V
EE
GND V
EE
GND GND
Z
V
CC
V
CC
LVTTL
Driver
EP91
D
D
1.5 V
Figure 10. Standard LVTTL Interface
Z
V
CC
V
CC
LVCMOS
Driver
EP91
D
D
Open
Figure 11. Standard LVCMOS Interface
(D
will default to V
CC
/2 when left open.
A reference voltage of V
CC
/2 should be applied
to D input, if D
is interfaced to CMOS signals)
GND
(externally generated
reference voltage)
MC100EP91
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8
Figure 12. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
Termination of ECL Logic Devices)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= GND 2.0 V
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC100EP91
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9
PACKAGE DIMENSIONS
SOIC20 WB
DW SUFFIX
CASE 751D05
ISSUE H
20
1
11
10
b20X
H
c
L
18X
A1
A
SEATING
PLANE
q
h X 45
_
E
D
M
0.25
M
B
M
0.25
S
A
S
B
T
e
T
B
A
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
b 0.35 0.49
c 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
11.00
20X
0.52
20X
1.30
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
10
20 11

MC100EP91MNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels PECL TO NECL TRNSLTR
Lifecycle:
New from this manufacturer.
Delivery:
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